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Vertical gate transistors in pass transistor logic decode circuits

Patent 6222788 Issued on April 24, 2001. Estimated Expiration Date: Icon_subject May 30, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

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Inventors

Application

No. 580860 filed on 05/30/2000

US Classes:

365/230.06, Particular decoder or driver circuit257/302, Vertical transistor257/315, With floating gate electrode257/E21.621, With particular manufacturing method of gate conductor, e.g., particular materials, shapes (EPO)257/E21.625, With particular manufacturing method of gate insulating layer, e.g., different gate insulating layer thicknesses, particular gate insulator materials or particular gate insulator implants (EPO)257/E29.264With multiple gate structure (EPO)

Examiners

Primary: Nguyen, Tan T.

Attorney, Agent or Firm

International Class

G11C 008/00

Abstract

Systems and methods are provided for vertical gate transistors in static pass transistor decode circuits. The vertical gate transistors have multiple vertical gates which are edge defined such that only a single transistor is required for multiple logic inputs. Thus a minimal surface area is required for each logic input. The novel decode circuits of the present invention include an address decoder for a memory device. The decode circuit includes a number of address lines and a number of output lines. The address lines and the output lines form an array. A number logic cells that disposed at the intersections of output lines and address lines. According to the teachings of the present invention each logic cell includes a source region and a drain region in a horizontal substrate. A depletion mode channel region separates the source and the drain regions. A number of vertical gates are located above different portions of the depletion mode channel region. At least one of the vertical gates is located above a first portion of the depletion mode channel region and is separated from the channel region by a first thickness insulator material. At least one of the vertical gates is located above a second portion of the channel region and is separated from the channel region by a second thickness insulator material. According to the present invention, there is no source nor drain region associated with each input and the gates have sub-lithographic horizontal dimensions by virtue of being edge defined vertical gates.

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