Photovoltaic module

Patent 6222115 Issued on April 24, 2001. Estimated Expiration Date:

March 14, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

Method of manufacture of solar cell panel
Patent #: 4067764
Issued on: 01/10/1978
Inventor: Walker , et al.

Roll formed pan solar module
Patent #: 4433200
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Inventor: Jester , et al.

Adherable reinforced poly(ethylene terephthalate) composite sheet
Patent #: 4468426
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Inventor: Hatchadoorian , et al.

Solar cell modules and method of making same
Patent #: 5478402
Issued on: 12/26/1995
Inventor: Hanoka

Solar cell and method for manufacturing the same Patent #: 5728230
Issued on: 03/17/1998
Inventor: Komori, et al.

Inventor

Nakanishi, Naoaki

Assignee

Kaneka Corporation

Application

No. 524633 filed on 03/14/2000

US Classes:

136/251, Encapsulated or with housing136/244, Panel or array136/256, Contact, coating, or surface geometry136/258, Polycrystalline or amorphous semiconductor257/433, With housing or encapsulation257/434, With window means257/E27.125, Including only thin film solar cells deposited on a substrate (EPO)257/E31.041Including thin film deposited on metallic or insulating substrate (EPO)

Examiners

Primary: Diamond, Alan

Attorney, Agent or Firm

Hogan & Hartson, LLP

Foreign Patent References

58-17685 JP. 02/12/1983
60-150658 JP. 08/12/1985
WO 95/06561 WO. 03/12/1995

International Class

H01L 031/048

Foreign Application Priority Data

1999-11-19 JP

Abstract

A photovoltaic module having a transparent substrate, solar cells formed on the back surface of the transparent substrate, an encapsulant resin for sealing the solar cells, and a back cover film formed on the back surface of the encapsulant resin, in which the back cover film includes at least a multi-layered film of a polyethylene terephthalate-based supporting film and an amorphous polyester-based heat seal layer formed on the surface of the supporting film which is positioned on the side of the encapsulant resin.