EMI reduction device and assembly
May 26, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesElectromagnetic shield for electrical circuit Technique for reducing electromagnetic interference EMI shielding device Personal computer cabinet cover with EMI clips Electronic assembly with improved grounding and EMI shielding EMI shield, and assembly using same Method for providing electromagnetic shielding of an electrical circuit Electronic devices with electromagnetic radiation interference shields and heat sinks Electronic device enclosure having electromagnetic energy containment and heat removal characteristics Electromagnetic interference shielding enclosure and heat sink with compression coupling mechanism InventorsApplicationNo. 320412 filed on 05/26/1999US Classes:361/704, Thermal conduction165/80.3, Air cooled, including fins361/715, For module361/818EMIExaminersPrimary: Thompson, Gregory D.International ClassesH05K 007/20H05K 009/00 AbstractAn EMI reduction device is coupled between a printed circuit board (PCB) assembly and a heat sink. The PCB assembly includes a processor core that is the source of unintentional electromagnetic interference (EMI). The EMI reduction device is attached to a heat sink which is positioned over the processor core such that it capacitively couples emissions from the processor core to a grounding plane resident in the PCB assembly, thereby reducing the unintentional EMI. Simultaneously, the EMI reduction device is able to maintain thermal contact with the heat sink.Other References
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