Semiconductor fabrication extended particle collection cup

Patent 6217936 Issued on April 17, 2001. Estimated Expiration Date:

February 26, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

Removal of coating from periphery of a semiconductor wafer
Patent #: 4510176
Issued on: 04/09/1985
Inventor: Cuthbert , et al.

Solution coating apparatus
Patent #: 5415691
Issued on: 05/16/1995
Inventor: Fujiyama, et al.

Rotary-cup coating apparatus
Patent #: 5571324
Issued on: 11/05/1996
Inventor: Sago, et al.

Coating apparatus and method
Patent #: 5580607
Issued on: 12/03/1996
Inventor: Takekuma, et al.

Coating apparatus
Patent #: 5672205
Issued on: 09/30/1997
Inventor: Fujimoto, et al.

Rotary-cup coating apparatus and method of coating object with such rotary-cup coating apparatus
Patent #: 5707687
Issued on: 01/13/1998
Inventor: Ueda, et al.

Detachable sponge device for spin-coating machines
Patent #: 5868843
Issued on: 02/09/1999
Inventor: Yang, et al.

Drip catching apparatus for receiving excess photoresist developer solution Patent #: 5940651
Issued on: 08/17/1999
Inventor: Pike, et al.

Inventor

Pike, Christopher Lee

Assignee

Advanced Micro Devices, Inc.

Application

No. 258834 filed on 02/26/1999

US Classes:

427/240, CENTRIFUGAL FORCE UTILIZED118/504WORK SURFACE SHIELDS, MASKS OR PROTECTORS

Examiners

Primary: Edwards, Laura

Attorney, Agent or Firm

Brinks Hofer Gilson & Lione

International Class

B05C 013/02

Abstract

An improved particle-collecting cup using a fabrication protective device for use in processing semiconductor wafers includes a deflective surface, a protective shield and a protective lip to protect the surface of the semiconductor. The deflective surface encircles the semiconductor and extends both above and below the semiconductor at an inclined angle. The radius of the opening formed by the upper end of the deflective surface is at least as small as the radius of the semiconductor. The protective shield extends downward toward the semiconductor and the protective lip is inclined outward. Any particles spun off from the fluid coating of the semiconductor that may have been reflected are guided away from the surface of the semiconductor by the semiconductor fabrication extended particle collection cup.