U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

System to minimize the temperature coefficient of resistance of passive resistors in an integrated circuit process flow

Patent 6211769 Issued on April 3, 2001. Estimated Expiration Date: Icon_subject December 8, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3491325

3683306

Low TCR resistor
Patent #: 4079349
Issued on: 03/14/1978
Inventor: Dorfeld

Precision resistor with improved temperature characteristics
Patent #: 4318072
Issued on: 03/02/1982
Inventor: Zandman

Silicon resistor having a very low temperature coefficient
Patent #: 4329774
Issued on: 05/18/1982
Inventor: Calligaro

Electrical partitioning scheme for improving yields during the manufacture of semiconductor memory arrays
Patent #: 4489401
Issued on: 12/18/1984
Inventor: Smarandoiu ,   et al.

Precision power resistor with very low temperature coefficient of resistance
Patent #: 4677413
Issued on: 06/30/1987
Inventor: Zandman ,   et al.

Lightly doped polycrystalline silicon resistor having a non-negative temperature coefficient
Patent #: 5240511
Issued on: 08/31/1993
Inventor: Kapoor

Semiconductor device having a thin-film resistor
Patent #: 5414404
Issued on: 05/09/1995
Inventor: Jeong, et al.

Polysilicon resistor cooling Patent #: 5640137
Issued on: 06/17/1997
Inventor: Mantha

Inventors

Assignee

Application

No. 207344 filed on 12/08/1998

US Classes:

338/7, RESISTANCE VALUE TEMPERATURE-COMPENSATED257/E21.004, Of resistor (EPO)257/E27.047, Resistor only (EPO)338/9, With additional compensating resistor or resistance element338/309Terminal coated on

Examiners

Primary: Gellner, Michael L.
Assistant: Lee, Kyung S.

Attorney, Agent or Firm

International Class

H01C 007/06

Abstract

An integrated circuit containing a resistor and the resistor per se. The circuit includes a substrate (2), a semiconductor resistor (3) on the substrate and a layer of electrically insulating material (5) disposed over the substrate and the semiconductor resistor having at least one contact (11, 13, 15) extending therethrough to the semiconductor resistor, the contact having an electrical path therein extending to and forming an interface with an end portion of the semiconductor resistor. The semiconductor resistor has a semiconductor resistor body, preferably of doped polysilicon, having one of a positive or negative temperature coefficient of resistance and a resistor head. The resistor head consists essentially of the electrical path which is metal interconnect, the contacts and then interface to and from the resistor body and in contact with the resistor body, the resistor head having the other of a positive or negative temperature coefficient of resistance.

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