Semiconductor package with wire protection and method therefor
Patent 6211574 Issued on April 3, 2001. Estimated Expiration Date: 
April 16, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
April 16, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMolded plastic package with wire protection Partially-molded, PCB chip carrier package for certain non-square die shapes Die assemblies using suspended bond wires, carrier substrates and dice having wire suspension structures, and methods of fabricating same Packaged die on PCB with heat sink encapsulant Patent #: 5866953 InventorsAssigneeApplicationNo. 292742 filed on 04/16/1999US Classes:257/784, Wire contact, lead, or bond257/667, With dam or vent for encapsulant257/787, ENCAPSULATED257/E21.502, Encapsulation, e.g., encapsulation layer, coating (EPO)257/E23.135Fillings or auxiliary members in containers or encapsulations, e.g., centering rings (EPO)ExaminersPrimary: Saadat, MahshidAssistant: Clark, Jhihan B Attorney, Agent or FirmForeign Patent References
International ClassesH01L 023/48H01L 023/52 H01L 029/40 AbstractA semiconductor package includes a semiconductor die mounted on an upper surface of a substrate. A number of wire bonds electrically connect between a number of bonding pads on the upper surface of the substrate and a number of bonding pads on an upper surface of the semiconductor die. A fixing portion surrounds the semiconductor die and covers a mediate portion of each wire bond. Encapsulating material is molded over the semiconductor die and the wire bonds to form an encapsulant. In an alternative embodiment, the fixing portion is provided on the upper surface of the substrate adjacent to a mold gate of the substrate where the wire sweeping is most likely to occur while molding. The fixing portion does not cover the semiconductor die to avoid thermal strain acting on the semiconductor die due to the different coefficients of thermal expansion between the fixing portion and the encapsulant. | |
