Deposition of resistor materials directly on insulating substrates
April 29, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3691007 3808576 Deposited layer type thermometric resistance structure Circuit board material Circuit board material and electroplating bath for the production thereof Resistive metal layers and method for making same Method for producing a circuit board material employing an improved electroplating bath Combustion chemical vapor deposition of films and coatings Chemical vapor deposition and powder formation using thermal spray with near supercritical and supercritical fluid solutions Patent #: 5997956 InventorsAssigneeApplicationNo. 069679 filed on 04/29/1998US Classes:216/16, Forming or treating resistive material216/20, Adhesive or autogenous bonding of self-sustaining preforms (e.g., prefabricated base, etc.)257/E21.004, Of resistor (EPO)338/308, Resistance element coated on base427/101Resistor for current control (excludes heating element)ExaminersPrimary: Gulakowski, RandyAssistant: Ahmed, Samir Attorney, Agent or FirmForeign Patent References
International ClassesH01C 001/12H01B 013/00 AbstractResistors are formed by selective etching from layered thin film material comprising an insulating substrate, a resistive material which is a mixture of a zero valence metal and a dielectric material, and a layer of conductive material.Other References
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