Sample inspection system
September 19, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesSurface pit detection system and method Surface analysis system and method Particle detection on patterned wafers and the like Method and apparatus for inspection of substrates Surface pit and mound detection and discrimination system and method Surface scanner with thin film gauge Microelectronics inspection system Optical wafer positioning system Optical scanning system utilizing an atomic force microscope and an optical microscope Single laser bright field and dark field system for detecting anomalies of a sample Patent #: 5798829 InventorsAssigneeApplicationNo. 933771 filed on 09/19/1997US Classes:356/237.4, On patterned or topographical surface (e.g., wafer, mask, circuit board)356/237.5On patterned or topographical surface (e.g., wafer, mask, circuit board)ExaminersPrimary: Pham, Hoa Q.Attorney, Agent or FirmForeign Patent References
International ClassG01N 021/00AbstractA curved mirrored surface is used to collect radiation scattered by a sample surface and originating from a normal illumination beam and an oblique illumination beam. The collected radiation is focused to a detector. Scattered radiation originating from the normal and oblique illumination beams may be distinguished by employing radiation at two different wavelengths, by intentionally introducing an offset between the spots illuminated by the two beams or by switching the normal and oblique illumination beams on and off alternately. Beam position error caused by change in sample height may be corrected by detecting specular reflection of an oblique illumination beam and changing the direction of illumination in response thereto. Butterfly-shaped spatial filters may be used in conjunction with curved mirror radiation collectors to restrict detection to certain azimuthal angles.Other References
Field of SearchINSPECTION OF FLAWS OR IMPURITIESSurface condition Detection of object or particle on surface On patterned or topographical surface (e.g., wafer, mask, circuit board) On patterned or topographical surface (e.g., wafer, mask, circuit board) Transparent or translucent material Patterned surface Surface condition Detection of an object or particle on surface With photocell detection At right angles to the light beam (e.g., nephelometer) Integrating spheres | |
