U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Thermoelectric converter

Patent 6185941 Issued on February 13, 2001. Estimated Expiration Date: Icon_subject February 8, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Thermoelectric heating or cooling device
Patent #: 5515683
Issued on: 05/14/1996
Inventor: Kessler

Storage box apparatus Patent #: 5987892
Issued on: 11/23/1999
Inventor: Watanabe, et al.

Inventors

Assignee

Application

No. 380060 filed on 02/08/2000

US Classes:

62/3.7, Including specific circuitry or heat exchanger material62/3.2, Thermoelectric; e.g., peltier effect62/434Flow line connected transfer fluid supply and heat exchanger

Examiners

Primary: Doerrler, William C.
Assistant: Jiang, Chen-Wen

Attorney, Agent or Firm

Foreign Patent References

  • 820 107 EP. 01/13/1998
  • 878 852 EP. 11/13/1998
  • 61-81579 JP. 05/13/1986
  • 64-22964 JP. 02/13/1989
  • 64-22964 JP. 02/13/1992
  • 6-294560 JP. 10/13/1994
  • 407250741 JP. 10/13/1995
  • 9-36438 JP. 02/13/1997
  • 409321348 JP. 12/13/1997
  • 10-12934 JP. 01/13/1998
  • WO98/10474 JP. 03/13/1998
  • 10-84139 JP. 03/13/1998
  • 10-93150 JP. 04/13/1998

International Class

F25B 021/02

Foreign Application Priority Data

1997-12-25 JP

Abstract

With an object to provide a thermoelectric converter excellent in performance, this invention provides a thermoelectric converter provided with a first thermal converter 1, a blocked second thermal conductor 2 connected to a predetermined position of the first conductor 1, a frame 6 made of a synthetic resin and surrounding the second conductor 2, a thermally-conductive substrate 5 with the frame 6 fixed at a basal end portion 8 thereof on the substrate and also with a group of thermoelectric elements 4 supported inside the substrate, and a heat-insulating layer 31 interposed between the first thermal conductor 1 and the thermally-conductive substrate 5 such that the frame 6 is surrounded at an outer periphery thereof by the heat-insulating layer. The second thermal conductor 2 and the thermally-conductive substrate 5 are opposing each other and are maintained in close contact with each other via the group of thermoelectric elements 4. The second thermal conductor 2 and the frame 6 are provided with an engaging flange 12, which prevents the second thermal conductor 2 from undergoing a displacement toward the first thermal conductor 1, and an engaged portion 9 which is in engagement with the engaging flange.

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