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ApplicationNo. 227035 filed on 01/07/1999
US Classes:428/447, As siloxane, silicone or silane257/E21.26, Layer comprising organo-silicon compound (EPO)257/E21.261, Layer comprising polysiloxane compound (EPO)427/240, CENTRIFUGAL FORCE UTILIZED428/3361 mil or less
ExaminersPrimary: Nakarani, D. S.
Attorney, Agent or Firm
Foreign Patent References
International ClassB32B 009/04
AbstractA method of making a dielectric film on a substrate from a composition containing an organohydridosiloxane resin is presented. The organohydridosiloxane resins have a cage conformation and up to 40 mole percent of an organic substituent. The process of making a dielectric film includes forming a solution of a solvent and the organohydridosiloxane resin, dispensing the solution on a substrate, spinning the substrate, baking the substrate to remove the solvent, and curing the substrate to form the dielectric film. The dielectric films of the present invention exhibit dielectric constants of approximately 3 or lower.