Method of manufacturing resin encapsulated semiconductor device
January 18, 2020. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethods for producing integrated circuit devices Semiconductor package and method thereof Method for manufacturing a semiconductor device Method of manufacturing an electric component which can be mounted on the surface of a printed circuit board Method of forming a chip scale package, and a tool used in forming the chip scale package Semiconductor device and method of manufacturing the same Method for constructing a leadless array package Patent #: 6004833 InventorAssigneeApplicationNo. 484900 filed on 01/18/2000US Classes:438/113, Substrate dicing257/E21.503, Encapsulation of active face of flip chip device, e.g., under filling or under encapsulation of flip-chip, encapsulation perform on chip or mounting substrate (EPO)438/108, Flip-chip-type assembly438/460SEMICONDUCTOR SUBSTRATE DICINGExaminersPrimary: Picardat, Kevin M.Attorney, Agent or FirmInternational ClassH01L 021/44Foreign Application Priority Data1999-01-20 JPAbstractA method of manufacturing a semiconductor device comprises the steps of providing a semiconductor wafer including semiconductor chip regions each of which has a protruding electrode formed on a main surface of the semiconductor wafer and scribe lines surrounding the semiconductor chip regions and providing a substrate including main body portions each of which corresponds to one of the semiconductor chip regions and cut lines each of which corresponds to one of the scribe lines, each of the main body portions having an inner pad formed on a chip mounting surface of the substrate and a connecting pad formed on a back surface of the substrate, the inner pad corresponding to the protruding electrode, each of the cut lines has a resin injecting hole extending from the chip mounting surface to the back surface. The method further comprises the steps of mounting the chip mounting surface of the substrate on the main surface of the semiconductor wafer so that the protruding electrodes are connected to the inner pads, respectively, injecting a resin to a space between the chip mounting surface and the main surface through resin injecting holes, curing the injected resin, and cutting the substrate, the cured resin and the semiconductor wafer along the cut lines so that semiconductor devices each of which includes the semiconductor chip region of the semiconductor wafer, the cured resin and the main body portion of the substrate are provided.Field of SearchSubstrate dicingUtilizing a coating to perfect the dicing Flip-chip-type assembly SEMICONDUCTOR SUBSTRATE DICING Beam lead formation Having specified scribe region structure (e.g., alignment mark, plural grooves, etc.) By electromagnetic irradiation (e.g., electron, laser, etc.) With attachment to temporary support or carrier Having a perfecting coating | |
