Structure for thin film interconnect

Patent 6165629 Issued on December 26, 2000. Estimated Expiration Date:

December 26, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

2692190

3181986

3466206

3541222

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Inventors

Application

No. 006414 filed on 01/21/1993

US Classes:

428/626, Synthetic resin257/E23.173, Multilayer substrates (EPO)257/E23.174, Conductive vias through substrate with or without pins, e.g., buried coaxial conductors (EPO)428/458, Next to polyester, polyamide or polyimide (e.g., alkyd, glue, or nylon, etc.)428/624, Organic component428/660, Refractory (Group IVB, VB, or VIB) metal-base component428/661Diverse refractory group metal-base components: alternative to or next to each other

Examiners

Primary: Nguyen, Ngoc-Yen

Attorney, Agent or Firm

Ahsan; Aziz M.

Foreign Patent References

62-108987 JP. 11/19/1988

International Class

B32B 015/08

Abstract

This invention relates generally to a structure and process for thin film interconnect, and more particularly to a structure and process for a multilayer thin film interconnect structure with improved dimensional stability and electrical performance. The invention further relates to a process of fabrication of the multilayer thin film structures. The individual thin film structure is termed a compensator, and functions as both a ground/reference plane and as a stabilizing entity with regard to dimensional integrity. The compensator is comprised primarily of a metal sheet having a metallized via pattern and high-temperature stable polymer as an insulator.

Other References

R. P. King, et al., "Screening Masks and Method of Fabrication" IBM Technical Disclosure Bulletin, vol. 20, No. 2, pp. 577-578 (Jul. 1977)
U.S. Patent Application Serial No. 07/503,401 filed on Mar. 30, 1990 entitled "Low TCE Polyimides" (IBM Docket No. FI9-90-012)
U.S. Patent Application Serial No. 07/695,368 filed on May 3, 1991 entitled "Multi-Layer Thin Film Structure and Parallel Processing Method for Fabricating Same" (IBM Docket No. YO9-90-062)
U.S. Patent Application Serial No. 07/740,760 filed on Aug. 5, 1991 entitled "Low RCE Polyimides as Improved Insulator in Multilayer Interconnect Structures" (IBM Docekt No. FI9-91-086