Multiacrylate cross-linking agents in pressure-sensitive photoadhesives
Mounting pad for solid-state devices
Pressure-sensitive adhesive containing heat-sensitive materials, and method of making the same
Vented riser for stripping spent catalyst
Photosensitive semi-aqueous developable ceramic coating composition
Thermally conductive interface materials and methods of using the same
UV-curable adhesive semiconductor chip mounting process
Pressure-sensitive adhesive having excellent heat-resistance, adhesive sheet using it, and method for producing those Patent #: 5462977
ApplicationNo. 194180 filed on 11/24/1998
US Classes:156/273.3, Before final assembly; e.g., to cure lamina, etc.257/E21.505, Insulative mounting semiconductor device on support (EPO)257/E23.107, Organic materials with or without thermo-conductive filler (EPO)428/345, Including irradiated or wave energy treated component522/71, Processes of preparing or treating a solid polymer by wave energy in the presence of a designated nonreactant material (DNRM); or compositions therefore522/184, Processes of preparing a solid polymer from ethylenic reactants only; or compositions therefore522/186At least one reactant contains two or more ethylenic groups
ExaminersPrimary: Gallagher, John J.
Attorney, Agent or Firm
Foreign Patent References
International ClassB32B 031/00
Foreign Application Priority Data1996-05-30 JP
AbstractA pressure-sensitive adhesive excellent in the heat resistance and the heat-conductivity comprising a photopolymerization product of a composition containing a) 100 parts by weight of an acrylic monomer mixture or the partial polymerized product thereof, b) from 0.01 to 5 parts by weight of a polyfunctional (meth)acrylate as a crosslinking agent, c) from 10 to 300 parts by weight of a ceramic powder made up of a covalent bond substance having the total valence electron number of 8 and having a wurtzite type or zincblende type crystal structure or a substance of a hexagonal system or a graphite structure, and d) from 0.01 to 5 parts by weight of a photopolymerization initiator; an adhesive sheet using the pressure-sensitive adhesive; and a fixing method of electronic parts and heat-radiating members using them. By using the adhesive materials, electronic parts and heat-radiating members can be easily fixed by adhesion without requiring much time and large labor, and there is no fear that peeling and deterioration occur, even when they are subjected to a heat cycle of quick heating and quick cooling.
Field of SearchProcesses of preparing or treating a solid polymer by wave energy in the presence of a designated nonreactant material (DNRM); or compositions therefore
Processes of preparing a solid polymer from ethylenic reactants only; or compositions therefore
At least one reactant contains two or more ethylenic groups
Including irradiated or wave energy treated component
Before final assembly; e.g., to cure lamina, etc.