Cleaning and drying method and apparatus
July 16, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3207167 Apparatus for treating printing plates Single vapor system for soldering, fusing or brazing Apparatus for fuse-bonding articles Industrial exhaust ventilation system Apparatus and method for reducing solvent vapor losses Dipping type surface treatment apparatus Substrate drying apparatus Apparatus and method for drying substrates Method and device for chemically treating substrates InventorApplicationNo. 116531 filed on 07/16/1998US Classes:134/61, Sequential work treating receptacles or stations with means to transfer work or fluid-applying devices134/140, Motor operated apparatus134/143, Interconnected tank closure and other movable element134/200, With closable work-treating chambers134/902, SEMICONDUCTOR WAFER257/E21.229Combining dry and wet cleaning steps (EPO)ExaminersPrimary: Stinson, Frankie L.Attorney, Agent or FirmForeign Patent References
International ClassB08B 003/04Foreign Application Priority Data1997-07-17 JPAbstractAn enclosure 23A that defines a drying chamber 23 is configured of a pair of enclosing elements 23c and 23d and a base element 23b. When wafers enter or leave the drying chamber 23, the enclosing elements 23c and 23d are lifted upward by vertical air cylinders 42 to separate them from the base element 23b. The enclosing elements 23c and 23d are then moved in directions that mutually separate them. To dry wafers within the drying chamber 23, the enclosing elements and the base element 23b are mutually engaged to form a hermetic seal, in the opposite sequence.The present invention reduces the dimensions of the drying chamber without impeding the work of moving wafers into and out of the drying chamber. This makes it possible to reduce the internal volume of the drying chamber, achieving a reduction is the consumption of drying gas, an improvement in the drying efficiency, and a reduction in overall size of the apparatus.Field of SearchWith closable work-treating chambersTraversing hoist-type work transfer means SEMICONDUCTOR WAFER Miscellaneous Sequential work treating receptacles or stations with means to transfer work or fluid-applying devices Motor operated apparatus Interconnected tank closure and other movable element | |
