Two-phase thermosyphon including air feed through slots
Patent 6148905 Issued on November 21, 2000. Estimated Expiration Date: 
April 30, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
April 30, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesEbullient cooled power devices Heat transfer apparatus Boiling refrigerant-type cooling system Hermetically sealed modular electronic cold plate utilizing reflux cooling Semiconductor cooling apparatus and cooling method thereof Heat pipe Patent #: 5076351 InventorAssigneeApplicationNo. 303014 filed on 04/30/1999US Classes:165/104.21, Utilizing change of state165/104.33, Cooling electrical device174/15.2, By heat pipe257/715, Boiling (evaporative) liquid257/E23.088, Cooling by change of state, e.g., use of heat pipes (EPO)361/700, Change of physical state361/703With cooling finsExaminersPrimary: Atkinson, ChristopherAttorney, Agent or FirmForeign Patent References
International ClassF28D 015/00AbstractThe present invention provides a two-phase thermosyphon (100) and a method for forming the two-phase thermosyphon (100). The two-phase thermosyphon (100) includes a hermetically sealed housing (101) including a first outer surface (107), a second outer surface (109) opposite the first outer surface (107), a first inner surface (111), and a second inner surface (113). The two-phase thermosyphon (100) also includes a finned area (114) thermally coupled to the hermetically sealed housing (101), the finned area (114) including a plurality of fins (115) disposed on a part of the first outer surface (107). The two-phase thermosyphon (100) also includes a plurality of air feed through slots (105) disposed in the housing (101). The air feed through slots (105) underlie the fins(115) and provide increased heat dissipation by increasing the air flow about the fins (115). The present invention is particularly useful in applications that require a two-phase thermosyphon utilized in a generally horizontal orientation. | |
