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Process control system using feed forward control threads based on material groups

Patent 6148239 Issued on November 14, 2000. Estimated Expiration Date: Icon_subject December 12, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Operator station for manufacturing process control system
Patent #: 5631825
Issued on: 05/20/1997
Inventor: van Weele, et al.

Attenuated phase shift mask with halftone boundary regions Patent #: 5786114
Issued on: 07/28/1998
Inventor: Hashimoto

Inventors

Assignee

Application

No. 989963 filed on 12/12/1997

US Classes:

700/1, GENERIC CONTROL SYSTEM, APPARATUS OR PROCESS700/10, Of analog controllers700/17, Operator interface (e.g., display with control)700/29, Having model700/247, Plural controlled devices or plural nonvision controlling devices703/18Power system

Examiners

Primary: Grant, William
Assistant: Marc, McDieunel

Attorney, Agent or Firm

International Class

G05B 015/00

Abstract

A process control system using feed forward control threads based on material groups performs material tracking to account and adjust for variability of processing in a process flow that includes multiple machines, machine configurations, and machine setups. The process control system using feed forward control threads based on material groups distinguishes variations in processing parameters and characteristics for processed material samples and modifies processing at subsequent steps in response to the variations. The process control system using feed forward control threads based on material groups controls materials groups so that material samples with a like processing history are processed with a similar machine configuration or setup for subsequent processing steps. The tagging of material groups permits management of material having different process characteristics in a process flow to improve the efficiency of material scheduling by supplying information to assist sorting of materials based on a manufacturing signature.

Other References

  • Boning et al., "Run by Run Control of Chemical-Mechanical Polishing" IEEE/CHMT International Electronics Manufacturing Technology Symposium, Austin, Texas Oct. 2-4, 1995
  • E. Zafiriou et al., "Nonlinear Model Based Run-to-Run Control for Rapid Thermal Processing with Unmeasured Variable Estimation" 187th ECS Meeting, Reno, NV, May 1995
  • Sachs et al., "Process Control System for VLSI Fabrication" submitted to IEEE Transactions on Semiconductor Manufacturing, Apr. 15, 1990, pp. 1-31
  • Hankinson et al., "Integrated Real-Time and Run-to-Run Control of Etch Depth in Reactive Ion Etching", Department of Electrical Engineering and Computer Science, University of Michigan, Ann Arbor, Michigan 48109-2122, Mar. 13, 1996, pp. 1-17
  • Smith et al., "Compensating for CMP Pad Wear Using Run by Run Feedback Control", VMIC, Santa Clara, CA, Jun. 18-20, 1996
  • Boning et al., "Practical Issues in Run by Run Process Control", 1995 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, pp. 201-20
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