U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Alignment correction prior to image sampling in inspection systems

Patent 6141038 Issued on October 31, 2000. Estimated Expiration Date: Icon_subject June 27, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

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Inventors

Assignee

Application

No. 884466 filed on 06/27/1997

US Classes:

348/87, Electronic circuit chip or board (e.g., positioning)348/126Of electronic circuit chip or board

Examiners

Primary: Lee, Young

Attorney, Agent or Firm

International Class

H04N 007/18

Abstract

A method and apparatus, and variations of each, for inspecting a wafer defining at least one die thereon is disclosed. The present invention first obtains the electronic image equivalent of two die, and then determines the x and y offset between those electronic images. Prior to inspection for defects, those two electronic images are aligned by adjusting the x and y positions of one electronic image of one die with respect to the electronic image of the other die. Once that is accomplished, those electronic images are compared to detect any defects that may exist on one of the die.

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