Apparatus and a method for conditioning a semiconductor wafer polishing pad
January 20, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod for conditioning the surface of a polishing pad Device for conditioning polishing pads Method and apparatus for conditioning a semiconductor polishing pad Method and apparatus for conditioning of chemical-mechanical polishing pads Apparatus and method for conditioning a planarizing substrate used in chemical-mechanical planarization of semiconductor wafers Apparatus and method for polishing workpiece Method and apparatus for polishing a semiconductor substrate wafer Apparatus and method for polishing workpiece Apparatus and method for distribution of slurry in a chemical mechanical polishing system Apparatus and method for conditioning a chemical mechanical polishing pad InventorApplicationNo. 009469 filed on 01/20/1998US Classes:451/56, With tool treating or forming451/443, Dressing451/444Tool cleanerExaminersPrimary: Banks, Derris H.Attorney, Agent or FirmInternational ClassB24B 001/00AbstractA semiconductor wafer polishing pad conditioner which includes a support structure and a roller which is rotatably mounted to the support structure. The roller has a working surface which is formed with a plurality of blades. | |
