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US Patent 6139404 - Apparatus and a method for conditioning a semiconductor wafer polishing pad
US Patent Issued on October 31, 2000
Estimated Patent Expiration Date:
January 20, 2018Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
Estimated Patent Expiration Date:
January 20, 2018Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.AbstractA semiconductor wafer polishing pad conditioner which includes a support structure and a roller which is rotatably mounted to the support structure. The roller has a working surface which is formed with a plurality of blades. | InventorApplicationNo. 009469 filed on 01/20/1998US Classes:451/56, With tool treating or forming451/443, Dressing451/444Tool cleanerField of Search451/41, Glass or stone abrading451/56, With tool treating or forming451/54, With critical nonabrading work treating451/60, Abradant supplying451/63, Side face of disk451/38, By blasting451/443, Dressing451/444, Tool cleaner451/442, ACCESSORY451/178, Rotary cylinder451/242Work rotatingExaminersPrimary: Banks, Derris H.Attorney, Agent or FirmUS Patent References5081051, Method for conditioning the surface of a polishing padIssued on: 01/14/1992 Inventor: Mattingly, et al.5486131, Device for conditioning polishing pads Issued on: 01/23/1996 Inventor: Cesna, et al.5547417, Method and apparatus for conditioning a semiconductor polishing pad Issued on: 08/20/1996 Inventor: Breivogel, et al.5611943, Method and apparatus for conditioning of chemical-mechanical polishing pads Issued on: 03/18/1997 Inventor: Cadien, et al.5645682, Apparatus and method for conditioning a planarizing substrate used in chemical-mechanical planarization of semiconductor wafers Issued on: 07/08/1997 Inventor: Skrovan5651725, Apparatus and method for polishing workpiece Issued on: 07/29/1997 Inventor: Kikuta, et al.5665656, Method and apparatus for polishing a semiconductor substrate wafer Issued on: 09/09/1997 Inventor: Jairath5674109, Apparatus and method for polishing workpiece Issued on: 10/07/1997 Inventor: Kanzawa, et al.5709593, Apparatus and method for distribution of slurry in a chemical mechanical polishing system Issued on: 01/20/1998 Inventor: Guthrie, et al.5775983, Apparatus and method for conditioning a chemical mechanical polishing pad Issued on: 07/07/1998 Inventor: Shendon, et al.5785585Polish pad conditioner with radial compensation Issued on: 07/28/1998 Inventor: Manfredi, et al. International ClassB24B 001/00 |
