Electro deposition chemistry
Patent 6113771 Issued on September 5, 2000. Estimated Expiration Date: 
July 13, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
July 13, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 2742413 2882209 3727620 3770598 Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water Apparatus for washing semiconductor wafers Electrodeposition of copper Spin coating process Molten salt lithium cells Electrodeposition of bright copper InventorsApplicationNo. 114865 filed on 07/13/1998US Classes:205/123, Product is semiconductor or includes semiconductor106/1.22, Metal-depositing composition contains mixtures of metal compounds other than solely as Group IA metal compounds, e.g., electroless106/1.25, Metal-depositing composition contains polyvalent metal compound106/1.26, Group IB (Cu, Au) metal205/261, Depositing predominantly single metal coating205/296, Utilizing organic compound-containing bath205/297, Nitrogen-heterocyclic compound-containing205/298And organic sulfur compound-containingExaminersPrimary: Gorgos, KathrynAssistant: Tran, Thai Attorney, Agent or FirmForeign Patent References
International ClassC25D 005/02AbstractThe present invention provides plating solutions, particularly metal plating solutions, designed to provide uniform coatings on substrates and to provide substantially defect free filling of small features, e.g., micron scale features and smaller, formed on substrates with none or low supporting electrolyte, i.e., which include no acid, low acid, no base, or no conducting salts, and/or high metal ion, e.g., copper, concentration. Additionally, the plating solutions may contain small amounts of additives which enhance the plated film quality and performance by serving as brighteners, levelers, surfactants, grain refiners, stress reducers, etc.Other References
Field of SearchDepositing predominantly single metal coatingUtilizing organic compound-containing bath Nitrogen-heterocyclic compound-containing And organic sulfur compound-containing Product is semiconductor or includes semiconductor Metal-depositing composition contains mixtures of metal compounds other than solely as Group IA metal compounds, e.g., electroless Metal-depositing composition contains polyvalent metal compound Group IB (Cu, Au) metal |
| ||||||||||||||
