U.S. patents available from 1976 to present.
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Semiconductor product manufacturing execution system and semiconductor product manufacturing method

Patent 6112130 Issued on August 29, 2000. Estimated Expiration Date: Icon_subject October 1, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

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Patent #: 5495417
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Method and device for manufacturing a semiconductor chip
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Inventors

Application

No. 942442 filed on 10/01/1997

US Classes:

700/121, Integrated circuit production or semiconductor fabrication700/105Rework or engineering change

Examiners

Primary: Grant, William
Assistant: Garland, Steven R.

Attorney, Agent or Firm

International Class

G06F 019/00

Foreign Application Priority Data

1996-10-02 JP

Abstract

A process flow, in which wafer processing conditions are described for forming a semiconductor through a plurality of processes, is formed for each lot in one type. A wafer processing is formed for each lot in one type of semiconductor in accordance with the process flow. When a different processing condition should be described according to a wafer in the lot in a certain process of the process flow, the process flow forming includes forming a plurality of different flows in that process by defining division/combination locations from a parent flow. When a faulty processing occurs in the wafer processing in a certain process, the process flow associated with that process is reformed, and a reprocessing is performed in accordance with the reformed process flow.

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