Methods for providing void-free layers for semiconductor assemblies

Patent 6107123 Issued on August 22, 2000. Estimated Expiration Date:

November 9, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

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Inventors

Application

No. 188599 filed on 11/09/1998

US Classes:

438/125, Insulative housing or support257/E23.055, Consisting of thin flexible metallic tape with or without film carrier (EPO)438/118Including adhesive bonding step

Examiners

Primary: Picardat, Kevin M.

Attorney, Agent or Firm

Lerner, David, Littenberg, Krumholz & Mentlik, LLP

International Class

H01L 021/44

Abstract

A method for the removal of voids and gas bubbles within uncured or partially cured microelectronic component enapsulants and adhesive/chip attach layers. A sealed void or gas bubble within a gap between a microelectronic component and a supporting substrate is substantially eliminated through the application of a uniform pressure (isostatic or hydrostatic) and energy such that a substantially void/bubble free interposer is created.