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Methods for providing void-free layers for semiconductor assemblies Patent #: 5834339
ApplicationNo. 188599 filed on 11/09/1998
US Classes:438/125, Insulative housing or support257/E23.055, Consisting of thin flexible metallic tape with or without film carrier (EPO)438/118Including adhesive bonding step
ExaminersPrimary: Picardat, Kevin M.
Attorney, Agent or Firm
International ClassH01L 021/44
AbstractA method for the removal of voids and gas bubbles within uncured or partially cured microelectronic component enapsulants and adhesive/chip attach layers. A sealed void or gas bubble within a gap between a microelectronic component and a supporting substrate is substantially eliminated through the application of a uniform pressure (isostatic or hydrostatic) and energy such that a substantially void/bubble free interposer is created.