Orbital motion chemical-mechanical polishing method and apparatus
February 1, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesLapping machine Polishing apparatus for end faces of optical fibers Methods of and apparatus for polishing an article Polishing pad conditioning apparatus for wafer planarization process Distributed polishing head Method and apparatus for improving planarity of chemical-mechanical planarization operations Apparatus for grinding end faces of ferrules together with optical fibers each firmly received in ferrules Surface polishing apparatus Patent #: 5584749 InventorsApplicationNo. 595182 filed on 02/01/1996US Classes:451/41, Glass or stone abrading451/60, Abradant supplying451/173Rotary work holderExaminersPrimary: Rose, Robert A.Attorney, Agent or FirmForeign Patent References
International ClassB24B 007/22AbstractA method and apparatus for polishing a thin film formed on a semiconductor substrate. A table covered with a polishing pad is orbited about an axis. Slurry is fed through a plurality of spaced-apart holes formed through the polishing pad to uniformly distribute slurry across the pad surface during polishing. A substrate is pressed face down against the orbiting pad's surface and rotated to facilitate, along with the slurry, the polishing of the thin film formed on the substrate.Field of SearchGlass or stone abradingAbradant supplying Abradant supplying Compound rectilinear motion Rotary work holder Reciprocating tool Orbital Planar surface abrading Having pressure plate Having vacuum or adhesive securing means Hydraulically actuated With critical temperature modification or control of work or abradant | |
