Package with integrated thermoelectric module for cooling of integrated circuits
Patent 6094919 Issued on August 1, 2000. Estimated Expiration Date: 
January 4, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
January 4, 2019. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesIntegrated thermoelectric cooling Wafer holding device in an exposure apparatus Thermoelectric cooling module and method for manufacturing the same Cooling system and method of cooling electronic devices Method for manufacturing cooling unit comprising heat pipes and cooling unit Patent #: 5960866 InventorApplicationNo. 225252 filed on 01/04/1999US Classes:62/3.7, Including specific circuitry or heat exchanger material62/3.2, Thermoelectric; e.g., peltier effect62/259.2, With electrical component cooling165/104.21, Utilizing change of state257/E23.082Cooling arrangements using Peltier effect (EPO)ExaminersPrimary: Bennett, HenryAssistant: Jiang, Chen-Wen Attorney, Agent or FirmForeign Patent References
International ClassF25B 021/02AbstractA package for an integrated circuit (IC) comprises a lid attached to a base, with the IC being disposed in a space or cavity between the lid and the base. A thermoelectric module (TEM) having first and second primary surfaces is incorporated into a section of the lid. The first primary surface is thermally coupled to the IC such that application of power to the TEM causes heat to be transferred away from the IC. | |
