U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

High resolution pressure sensing device having an insulating flexible matrix loaded with filler particles

Patent 6073497 Issued on June 13, 2000. Estimated Expiration Date: Icon_subject August 5, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Pattern recognition system
Patent #: 4021776
Issued on: 05/03/1977
Inventor: Tech

Pressure sensitive switch structure
Patent #: 4296406
Issued on: 10/20/1981
Inventor: Pearson

Pressure sensitive conductor
Patent #: 4302361
Issued on: 11/24/1981
Inventor: Kotani ,   et al.

Coordinate input apparatus
Patent #: 4775765
Issued on: 10/04/1988
Inventor: Kimura ,   et al.

Tactile sensing transducer Patent #: 5060527
Issued on: 10/29/1991
Inventor: Burgess

Inventors

Application

No. 906583 filed on 08/05/1997

US Classes:

73/862.68By measuring electrical properties

Examiners

Primary: Fuller, Benjamin R.
Assistant: Thompson, Jewel V.

Attorney, Agent or Firm

Foreign Patent References

  • 196 47 876 DE. 04/13/1997

International Class

G01L 001/16

Abstract

A high-resolution pressure-sensing device is disclosed. The device includes an insulating flexible matrix having a plurality of filler particles. Application of a force to the matrix causes compression of the matrix. This results in the filler particles occupying a greater amount of space within the matrix relative to when no force is applied. A detector attached to the matrix detects or measures the volume of the filler particles relative to the volume of the matrix, and therefore determines the force applied to the matrix. Preferably, the resistivity of the matrix is inversely proportional to the volume percent of the filler particles, in which case the detector is a resistance-measuring circuit.

Other References

  • Aharoni, S., "Electrical Resistivity of a Composite of Conducting Particles in an Insulating Matrix", J. Appl. Phys., 43, 2463-2465, (May 1972)
  • Lai, Z., et al., "Anisotropically Conductive Adhesive Flip-Chip Bonding on Rigid and Flexible Printed Circuit Substrates", IEEE Trans. on Components, Packaging, and Manufacturing Technology--Part B, 19, 644-660, (Aug. 1996)
  • Li, L., et al., "Electrical Conduction Models for Isotropically Conductive Adhesive Joints", IEEE Trans. on Components, Packaging, and Manufacturing Technology--Part A, 20, 3-8, (Mar. 1997)
  • Li, L. et al., "Electrically Conducting Powder Filled Polyimidesiloxane", Composites, 22, 211-218, (May 1991
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