U.S. patents available from 1976 to present.
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Printed circuit board with electronic devices mounted thereon

Patent 6052284 Issued on April 18, 2000. Estimated Expiration Date: Icon_subject July 29, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Cartridge having improved electrostatic discharge protection
Patent #: 4531176
Issued on: 07/23/1985
Inventor: Beecher, II

Semiconductor cooling device
Patent #: 5021924
Issued on: 06/04/1991
Inventor: Kieda, et al.

Liquid impingement cooling module for semiconductor devices
Patent #: 5270572
Issued on: 12/14/1993
Inventor: Nakajima, et al.

Integrated multi-chip module having a conformal chip/heat exchanger interface
Patent #: 5323292
Issued on: 06/21/1994
Inventor: Brzezinski

Cooling of semiconductor power modules by flushing with dielectric liquid
Patent #: 5448108
Issued on: 09/05/1995
Inventor: Quon, et al.

Apparatus for preventing the formation of condensation on sub-cooled integrated circuit devices
Patent #: 5574627
Issued on: 11/12/1996
Inventor: Porter

Low thermal resistant, fluid-cooled semiconductor module
Patent #: 5774334
Issued on: 06/30/1998
Inventor: Kawamura, et al.

Liquid-cooled baffle series/parallel heat sink Patent #: 5841634
Issued on: 11/24/1998
Inventor: Visser

Inventors

Assignee

Application

No. 902154 filed on 07/29/1997

US Classes:

361/699, Liquid165/80.4, Liquid cooled174/15.1, With cooling or fluid feeding, circulating or distributing257/E23.098, By flowing liquids (EPO)361/689, Fluid361/698, And liquid361/704, Thermal conduction361/719, Circuit board mounted361/720For printed circuit board

Examiners

Primary: Picard, Leo P.
Assistant: Chervinsky, Boris

Attorney, Agent or Firm

Foreign Patent References

  • 0243239 A2 EP. 10/13/1987
  • 0341950 A2 EP. 11/13/1989
  • 2359148 DE 08/13/1974
  • 2-188995 JP 07/13/1990
  • 3-50897 JP 03/13/1991
  • 2183304 GB. 06/13/1987

International Class

H05K 007/20

Foreign Application Priority Data

1996-08-06 JP

Abstract

A cooler-equipped printed circuit board, in which electronic devices arranged in a matrix form on the printed circuit board are covered with a sealed case held in liquidtight contact with the board and having a coolant channel from an inlet port and an outlet port made in the case. Barriers are provided in the coolant channel to change the direction of flow of the coolant to stir it and make its temperature uniform throughout it.

Other References

  • "Heat Transfer in a Liquid Cooling System" Cohen et al. IBM Technical Disclosure Bulletin, vol. 11, No. 6, Nov. 1968
  • "High -Power Electronic Package" D. J. Crawford IBM Technical Disclosure Bulletin, vol. 20, No. 11A, Apr. 1978
  • "Cold Plate for Thermal Conduction Module with Reduced Water Flow Resistance< Increased Fin Area< and Improved Water Turbulence" IBM Technical Disclosure Bulletin, vol. 29, No. 2, Jul. 198
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