Patent ReferencesMethod for producing semiconductor devices Semiconductor integrated circuit device fabrication method and its fabrication apparatus Method for controlling semiconductor wafer processing Semiconductor production system Dynamic process window control using simulated wet data from current and previous layer data Patent #: 5866437 InventorsAssigneeApplicationNo. 985470 filed on 12/05/1997US Classes:700/121, Integrated circuit production or semiconductor fabrication257/E21.525, Procedures, i.e., sequence of activities consisting of plurality of measurement and correction, marking or sorting steps (EPO)438/14, WITH MEASURING OR TESTING438/15, Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor700/110Defect analysis or recognitionExaminersPrimary: Grant, WilliamAssistant: Cabrera, Zoila Attorney, Agent or FirmInternational ClassesH01L 021/66G06F 019/00 AbstractA method of manufacturing semiconductor wafers using a simulation tool to determine a set of predicted wafer electrical test measurements that are compared to a set of target wafer electrical test measurements to obtain a set of optimized process parameters for the equipment for the next process. The optimized process parameters are compared to the equipment characteristics for the equipment of the next process and the process parameters for the next process are automatically adjusted. | |