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Automatic recipe adjust and download based on process control window

Patent 6041270 Issued on March 21, 2000. Estimated Expiration Date: Icon_subject December 5, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Method for producing semiconductor devices
Patent #: 5105362
Issued on: 04/14/1992
Inventor: Kotani

Semiconductor integrated circuit device fabrication method and its fabrication apparatus
Patent #: 5497331
Issued on: 03/05/1996
Inventor: Iriki, et al.

Method for controlling semiconductor wafer processing
Patent #: 5661669
Issued on: 08/26/1997
Inventor: Mozumder, et al.

Semiconductor production system
Patent #: 5694325
Issued on: 12/02/1997
Inventor: Fukuda, et al.

Dynamic process window control using simulated wet data from current and previous layer data Patent #: 5866437
Issued on: 02/02/1999
Inventor: Chen, et al.

Inventors

Assignee

Application

No. 985470 filed on 12/05/1997

US Classes:

700/121, Integrated circuit production or semiconductor fabrication257/E21.525, Procedures, i.e., sequence of activities consisting of plurality of measurement and correction, marking or sorting steps (EPO)438/14, WITH MEASURING OR TESTING438/15, Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor700/110Defect analysis or recognition

Examiners

Primary: Grant, William
Assistant: Cabrera, Zoila

Attorney, Agent or Firm

International Classes

H01L 021/66
G06F 019/00

Abstract

A method of manufacturing semiconductor wafers using a simulation tool to determine a set of predicted wafer electrical test measurements that are compared to a set of target wafer electrical test measurements to obtain a set of optimized process parameters for the equipment for the next process. The optimized process parameters are compared to the equipment characteristics for the equipment of the next process and the process parameters for the next process are automatically adjusted.

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