Semiconductor device having a multiple-terminal integrated circuit formed on a circuit substrate Patent #: 5909054
ApplicationNo. 013934 filed on 01/27/1998
US Classes:257/432, With optical element257/433, With housing or encapsulation257/696, Bent (e.g., J-shaped) lead257/698, With specific electrical feedthrough structure257/774, Via (interconnection hole) shape257/E31.111, Input/output circuit of device (EPO)257/E31.118For device having potential or surface barrier (EPO)
ExaminersPrimary: Tran, Minh Loan
Attorney, Agent or Firm
International ClassH01L 031/023.2
Foreign Application Priority Data1997-02-07 JP
AbstractAn image pickup apparatus or method of the present invention decreases the diameter of an image pickup device assembly by decreasing the thickness of the assembly. A conductor lead (inner lead of TAB product) is formed on a terminal of a CCD so as to protrude from the outer periphery of the main frame of an image pickup device body in accordance with the TAB (Tape Automated Bonding) method capable of realizing mass production, a cover glass is set so that an air gap is formed between the CCD and its image pickup plane side, and thereby an image pickup device body is formed. Moreover, the image pickup device body is set to an aperture of a circuit board to connect the conductor lead to a terminal at the circuit board side. Thereby, it is unnecessary to use a conventional box-type package for storing the CCD.