Energy beam curable hydrophilic pressure sensitive adhesive composition and use thereof

Patent 6040048 Issued on March 21, 2000. Estimated Expiration Date:

August 27, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

Process for producing adhesive film
Patent #: 4312916
Issued on: 01/26/1982
Inventor: Kakumaru , et al.

Radiation-curable adhesive tape
Patent #: 5149586
Issued on: 09/22/1992
Inventor: Ishiwata, et al.

Actinic radiation-reactive pressure-sensitive adhesive composition wherein adhesiveness is reduced upon irradiation
Patent #: 5278199
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Inventor: Ohkawa, et al.

Radiation-curable adhesive tape
Patent #: 5281473
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Patent #: 5302629
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Inventor: Berejka

Actinic radiation-reactive pressure-sensitive adhesive composition Patent #: 5360873
Issued on: 11/01/1994
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Inventors

Assignee

Lintec Corporation

Application

No. 141385 filed on 08/27/1998

US Classes:

428/345, Including irradiated or wave energy treated component427/208.4, Pressure sensitive adhesive427/517, Coating includes specified rate affecting material428/343, Adhesive outermost layer428/355R, Adhesive compositions428/355AC, Including addition polymer from alpha-beta unsaturated carboxylic acid (e.g., acrylic acid, methacrylic acid, etc.) or derivative thereof522/95, With solid polymer derived solely from ethylenic monomers522/120, Oxygen522/121Chemical reactant has two or more ethylenic groups

Examiners

Primary: Seidleck, James J.
Assistant: McClendon, Sanza L.

Attorney, Agent or Firm

Webb Ziesenheim Logsdon Orkin & Hanson, P.C.

Foreign Patent References

0157508 EP. 10/20/1985
0252739 EP. 01/20/1988
0252739 EP. 10/20/1993
0745654 EP. 12/20/1996
60-196956 JP. 10/20/1985
60-223139 JP. 11/20/1985
61-043677 JP. 03/20/1986
62-101678 JP. 05/20/1987
05335288 JP. 12/20/1993
0687260 JP. 10/20/1994
06287260 JP. 02/20/1995
8-27239 JP. 01/20/1996
08027239 JP. 01/20/1996
2184741 GB. 07/20/1987

International Class

B32B 007/12

Foreign Application Priority Data

1997-08-28 JP

Abstract

An energy beam curable hydrophilic pressure sensitive adhesive composition comprising a hydrophilic pressure sensitive adhesive (A) and an energy beam polymerizable compound (B), optionally together with a photopolymerization initiator (C) added according to necessity. Thus, a pressure sensitive adhesive composition suitable for use in a wafer surface protective sheet is provided, which enables easy removal of any residual pressure sensitive adhesive by washing with water, even if the pressure sensitive adhesive remains on the wafer surface after peeling of the pressure sensitive adhesive sheet.