Method and system for evaluating integrity of adherence of a conductor bond to a mating surface of a substrate
System for characterizing semiconductor materials and photovoltaic devices through calibration Patent #: 5757474
ApplicationNo. 311271 filed on 05/14/1999
US Classes:356/237.1, INSPECTION OF FLAWS OR IMPURITIES356/334, With diffraction grating means356/394, With comparison to master, desired shape, or reference voltage356/613Silhouette
ExaminersPrimary: Font, Frank G.
Assistant: Ratliff, Reginald A.
Attorney, Agent or Firm
International ClassG01N 021/00
Foreign Application Priority Data1998-05-15 JP
AbstractA substrate inspecting system 60 observes and inspect a semiconductor wafer pattern by irradiating the surface of the semiconductor wafer 11 with electron beams 31, and making a projection unit project in enlargement secondary electrons, reflected electrons and backward scattered electrons generated therefrom in the form of secondary electron beams 32 on an undersurface of an electron beam detecting unit 61, and form an image thereon. The substrate inspecting system 60 includes a parallel-plate type energy filter 33 in a projection system. The present invention discloses a substrate inspecting apparatus capable of detecting a voltage contrast defect on a sample with a high accuracy by separating the secondary electron beams and fetching a secondary electron beam having an energy over a predetermined value, and of quantitatively measuring this defect, a substrate inspecting system having this apparatus, and a substrate inspecting method.