Support for wafer-shaped objects, in particular silicon wafers

Patent 6022417 Issued on February 8, 2000. Estimated Expiration Date:

February 18, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

Pressure foot for machine tool
Patent #: 4158987
Issued on: 06/26/1979
Inventor: Smith

Support for slice-shaped articles and device for etching silicon wafers with such a support
Patent #: 4903717
Issued on: 02/27/1990
Inventor: Sumnitsch

Gas-based backside protection during substrate processing
Patent #: 5230741
Issued on: 07/27/1993
Inventor: van de Ven, et al.

Adjustable alignment for cryogen venting system for superconducting magnet
Patent #: 5291739
Issued on: 03/08/1994
Inventor: Woods, et al.

Vacuum chuck with venturi jet for converting positive pressure to a vacuum
Patent #: 5421595
Issued on: 06/06/1995
Inventor: Cripe, et al.

Substrate holding apparatus Patent #: 5738165
Issued on: 04/14/1998
Inventor: Imai

Inventor

Sumnitsch, Franz

Application

No. 981930 filed on 02/18/1998

US Classes:

118/728, Work support156/345.55With means to cause rotary movement of the workpiece

Examiners

Primary: Breneman, R. Bruce
Assistant: Powell, Alva C

Attorney, Agent or Firm

Young & Thompson

Foreign Patent References

0 109 080 EP. 05/22/1984
0 456 426 EP. 11/22/1991
0 467 623 EP. 01/22/1992
0 611 273 EP. 08/22/1994
2 566 682 FR. 01/22/1986
256 952 DE. 05/22/1988

International Class

H01L 021/68

Foreign Application Priority Data

1995-07-12 AT

Abstract

In a support for a wafer-shaped object, in particular a silicon wafer, there is an annular nozzle in the surface of the support opposite the wafer-shaped object. The surface of the support includes concentric annular projections for supporting the wafer. Between the projections there is at least one aperture from which a passage extends to a vacuum producing device housed inside the support. As a result of the prevailing vacuum beneath the projections, the object is held in contact with the support and prevented from moving in a direction parallel to the surface, without requiring lateral supports. The compressed gas that creates the vacuum is ejected from the annular nozzle to clean the edges of the wafer-shaped object.