Methods for using polishing pads
January 13, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3763054 3917761 Porous sheets and method of manufacture Self-supporting structures containing immobilized carbon particles and method for forming same Method of compressively molding articles from resin coated filler materials Substrate containing fibers of predetermined orientation and process of making the same Composition and process for making porous articles from ultra high molecular weight polyethylene Pad material for grinding, lapping and polishing Process for the production of materials characterized by a continuous web matrix or force point bonding Polishing pad conditioning apparatus for wafer planarization process Patent #: 5216843 Inventors
ApplicationNo. 782717 filed on 01/13/1997US Classes:451/41, Glass or stone abrading51/298, WITH SYNTHETIC RESIN451/59, Utilizing nonrigid tool451/63Side face of diskExaminersPrimary: Eley, Timothy V.Attorney, Agent or FirmInternational ClassB24B 001/00AbstractPolymer-based pads useful for polishing objects, particularly integrated circuits, having interconnected porosity which is uniform in all directions, and where the solid portion of said pad consists of a uniform continuously interconnected polymer material of greater than 50% of the gross volume of the article, are produced directly to final shape and dimension by pressure sintering powder compacts of thermoplastic polymer at a temperature above the glass transition temperature but not exceeding the melting point of the polymer and at a pressure in excess of 100 psi in a mold having the desired final pad dimensions. In a preferred version, a mixture of two polymer powders is used, where one polymer has a lower melting point than the other. When pressure sintered at a temperature not to exceed the melting point of the lower melting powder, the increased stiffness afforded by incorporation of the higher melting polymer component gives improved mechanical strength to the sintered product. Conditions for producing the pads of this invention are such that the polymer powder particles from which the pads are produced essentially retain their original shape and are point bonded to form the pad.Other References
Field of SearchOf organic materialFluorocarbon resin Continuous and nonuniform or irregular surface on layer or component (e.g., roofing, etc.) Bicomponent, conjugate, composite or collateral fibers or filaments (i.e., coextruded sheath-core or side-by-side type) Glass or stone abrading Utilizing nonrigid tool Side face of disk Cellular product derived from a -N=C=X containing reactant wherein X is a chalcogen atom IMPREGNATING OR COATING AN ABRASIVE TOOL WITH SYNTHETIC RESIN | |
