Patent ReferencesStructure of an electronic device including a number of printed circuit boards High density packaging for device requiring large numbers of unique signals utilizing orthogonal plugging and zero insertion force connetors Switching midplane and interconnection system for interconnecting large numbers of signals Backplane wiring for hub in packet data communications system Patent #: 5583867 InventorsAssigneeApplicationNo. 919825 filed on 08/28/1997US Classes:439/61, Receives plural panel circuit edges361/788Having backplane connectionExaminersPrimary: Stephan, Steven L.Assistant: Patel, T. C. Attorney, Agent or FirmInternational ClassH01R 009/09AbstractA module interconnection system which minimizes electronic signal propagation delays is disclosed. The module interconnection system includes a backplane, a first plurality of connectors arranged in a side by side generally parallel arrangement, and a second plurality of connectors arranged in a side by side generally parallel arrangement. In a preferred embodiment, the second plurality of connectors are mounted on the backplane at right angles to the first plurality of connectors so as provide short routing paths between each of the second plurality of connectors and at least one of the first plurality of connectors. Point-to-point signal interconnections are selectively utilized to provide data paths between selected contacts of at least one of the first plurality of connectors and selected contacts of the second plurality of connectors. The above described interconnection apparatus permits high speed data communication between modules disposed in at least one of said first plurality of connectors and at least one module disposed in said second plurality of connectors. | |