Lead-free solder process
Patent 6010060 Issued on January 4, 2000. Estimated Expiration Date: 
April 2, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
April 2, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesLead-free alloy containing tin, silver and indium Lead-free, high temperature, tin based multi-component solder Composite solders Lead-free alloy containing tin, silver and indium Article comprising a Pb-free solder having improved mechanical properties Patent #: 5762866 InventorsApplicationNo. 054375 filed on 04/02/1998US Classes:228/179.1, Of electrical device (e.g., semiconductor)228/180.1, Simultaneous bonding of multiple joints (e.g., dip soldering of printed circuit boards)228/180.21, Component terminal to substrate surface (i.e., nonpenetrating terminal)228/248.1Applied in powdered or particulate formExaminersPrimary: Heinrich, Samuel M.Attorney, Agent or FirmForeign Patent References
International ClassH05K 003/34AbstractA high solidus temperature, high service temperature, high strength ternary solder alloy, solder paste and method. The alloy contains a major proportion of tin of at least about 70% by weight, a selectively limited amount of silver from about 6.5 to about 7.5% by weight, balance indium.Field of SearchOf electrical device (e.g., semiconductor)Simultaneous bonding of multiple joints (e.g., dip soldering of printed circuit boards) Component terminal to substrate surface (i.e., nonpenetrating terminal) Lead-less (or "bumped") device Applied in powdered or particulate form Metallic By metal fusion TIN BASE Copper containing Antimony, or bismuth containing Antimony, or bismuth containing | |
