Polishing plate and method for polishing surfaces
Slurries for chemical mechanical polishing
Wafer polishing apparatus and method
Apparatus for planarizing semiconductor wafers, and a polishing pad for a planarization apparatus
Truing apparatus for wafer polishing pad
Semiconductor substrate conditioning head having a plurality of geometries formed in a surface thereof for pad conditioning during chemical-mechanical polish
Orbital motion chemical-mechanical polishing apparatus and method of fabrication
Polishing pad conditioning
Dressing apparatus and method
Chemical-mechanical polishing apparatus with slurry removal system and method
ApplicationNo. 895960 filed on 07/17/1997
US Classes:451/285, Rotary work holder451/56, With tool treating or forming451/288, Having pressure plate451/443Dressing
ExaminersPrimary: Morgan, Eileen P.
Foreign Patent References
International ClassB24B 005/00
AbstractAn apparatus is provided for conditioning a polishing pad used for chemical-mechanical polishing. The apparatus comprises the retainer ring used to retain the semiconductor wafer against the polishing pad. Accordingly, the retainer ring serves a dual purpose: to retain the wafer in proper CMP position as well as condition the polishing surface while polishing of the wafer. The retainer ring includes an inner surface defining an opening to receive the semiconductor wafer. Dimensioned radially outside the inner surface is an outer surface. Placed on the distal ends between the inner and outer surfaces is an abrasive surface. The abrasive surface extends along a plane parallel to the retained frontside surface of the wafer. Both the wafer and the abrasive surface contact the polishing surface either in a rotation about a stationary axis or orbital movement about that axis. The wafer surface can be pressed to a greater or lesser extent against the polishing pad independent of the pressure exerted by the abrasive surface on that pad radially outside the wafer.