U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Two dimensional thermoelectric cooler configuration

Patent 6000225 Issued on December 14, 1999. Estimated Expiration Date: Icon_subject April 27, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

3159979

3879229

Thermoelectric voltage generator
Patent #: 4095998
Issued on: 06/20/1978
Inventor: Hanson

Thermoelectric refrigerator having improved temperature stabilization means
Patent #: 4362023
Issued on: 12/07/1982
Inventor: Falco

Device for regulating the temperature of materials
Patent #: 4453385
Issued on: 06/12/1984
Inventor: May

Solid-state heating and cooling apparatus
Patent #: 4463569
Issued on: 08/07/1984
Inventor: McLarty

Thermoelectric generator for engine exhaust
Patent #: 4673863
Issued on: 06/16/1987
Inventor: Swarbrick

Vapor-compression-cycle refrigeration system having a thermoelectric condenser
Patent #: 5361587
Issued on: 11/08/1994
Inventor: Hoffman

Apparatus and method for deep thermoelectric refrigeration
Patent #: 5385022
Issued on: 01/31/1995
Inventor: Kornblit

Dehumidifier
Patent #: 5448891
Issued on: 09/12/1995
Inventor: Nakagiri, et al.

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Inventor

Application

No. 067148 filed on 04/27/1998

US Classes:

62/3.7, Including specific circuitry or heat exchanger material62/335PLURAL PAIRED DIFFERENT FUNCTION REFRIGERATION PRODUCING ELEMENTS, E.G., CASCADE

Examiners

Primary: Doerrler, William C.

Attorney, Agent or Firm

International Class

F25B 021/02

Abstract

A system for efficiently transferring heat from a cold sink to a hot source utilizing thermoelectric cooling effects is disclosed. A plurality of thermoelectric elements are coupled in a series configuration with a power source. The plurality of thermoelectric elements are coupled in a parallel configuration with the cold sink and the hot source. The surface area of the hot source is greater than the surface area of the cold sink such that the plurality of thermoelectric elements can effectively transfer heat from the cold sink to the hot source in response to the power source. The plurality of thermoelectric can be fabricated on an integrated circuit with analog or digital circuity and effectively cool hot spots.

Other References

  • Gerald Mahan et al., "Thermoelectric Materials: New Approaches To An Old Problem," American Institute of Physics, Physics Today, pp. 42-47, Mar. 1997
  • Boris Moyzhes, "Possible Ways for Efficiency Improvement Of Thermoelectric Materials," IEEE 15th International Conference on Thermoelectrics, pp. 183-187, 1996
  • L.D. Hicks et al., "Experimental Study of the Effect of Quantum-Well Structures on the Thermoelectric Figure of Merit," IEEE 15th International Conference on Thermoelectrics, pp. 450-453, 199
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