Attachment method for assembly of high density multiple interconnect structures
Patent 5998291 Issued on December 7, 1999. Estimated Expiration Date: 
April 7, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
April 7, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod of making a extended integration semiconductor structure Process for manufacturing a multilayer integrated circuit interconnection Parallel manufacturing of semiconductor devices and the resulting structure Methods of forming two-sided HDMI interconnect structures Method of making a three-dimensional integrated circuit Patent #: 5877034 InventorsAssigneeApplicationNo. 845633 filed on 04/07/1997US Classes:438/618, Contacting multiple semiconductive regions (i.e., interconnects)216/20, Adhesive or autogenous bonding of self-sustaining preforms (e.g., prefabricated base, etc.)257/E23.172, Assembly of plurality of insulating substrates (EPO)257/E23.177, Flexible insulating substrates (EPO)438/107, Assembly of plural semiconductive substrates each possessing electrical device438/455, BONDING OF PLURAL SEMICONDUCTOR SUBSTRATES438/622Multiple metal levels, separated by insulating layer (i.e., multiple level metallization)ExaminersPrimary: Whitehead, Carl Jr.Assistant: Dvong, Khanh Attorney, Agent or FirmInternational ClassH01L 021/476.3AbstractMethod of fabricating high density multilayer interconnect structures or flexible HDMI decals. The methods secure a top surface of an HDMI decal fabricated on a rigid substrate to a protective film layer which is in turn adhesively secured to a flat carrier. This structure is then demounted or delaminated from the rigid substrate. The bottom of the HDMI decal, with the protective film layer and flat carrier attached thereto, is secured to a mounting substrate using a relatively thick adhesive layer. After the HDMI decal is adhesively secured to the mounting substrate, the carrier and protective film layer are removed. The top surface of the HDMI decal thus remains flat after it is secured to the mounting substrate, and therefore connection of integrated circuit chips to contact pads on the top surface of the decal is ensured because this surface is flat. The carrier and protective film layer also protects the top surface of the decal while it is secured to the mounting substrate.Field of SearchBONDING OF PLURAL SEMICONDUCTOR SUBSTRATESWith attachment to temporary support or carrier Separating insulating layer is laminate or composite of plural insulating materials Multiple metal levels, separated by insulating layer (i.e., multiple level metallization) Contacting multiple semiconductive regions (i.e., interconnects) Planarization Having adhesion promoting layer Plural layered electrode or conductor Having adhesion promoting layer Warping of semiconductor substrate Subsequent separation into plural bodies (e.g., delaminating, dicing, etc.) Diverse conductive layers limited to viahole/plug Assembly of plural semiconductive substrates each possessing electrical device Flip-chip-type assembly PACKAGING (E.G., WITH MOUNTING, ENCAPSULATING, ETC.) OR TREATMENT OF PACKAGED SEMICONDUCTOR Adhesive or autogenous bonding of self-sustaining preforms (e.g., prefabricated base, etc.) | |
