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US Patent 5995328 - Multi-layered integrated conductor trace array interconnect structure having optimized electrical parameters
US Patent Issued on November 30, 1999
Estimated Patent Expiration Date:
April 6, 2018Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
Estimated Patent Expiration Date:
April 6, 2018Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.AbstractA head suspension has an integrated multi-layer trace conductor array for supporting and electrically interconnecting a read/write head to electronic circuitry in a disk drive. The electrical micro strip transmission line characteristics of the conductor array is controlled by the selective placement and connection of the trace paths within the multiple layers in order to control and balance electrical parameters including array inductance, inter-trace capacitance, and trace capacitance to a ground plane. The ground plane may further comprise a solid sheet of material or an arrangement of grounded traces disposed in proximity to signal-carrying traces of the micro strip transmission line in order to control and obtain desired electrical characteristics. | InventorAssigneeApplicationNo. 056893 filed on 04/06/1998US Classes:360/245.9Flexible printed circuit typeExaminersPrimary: Evans, JeffersonAttorney, Agent or FirmUS Patent References4819094, Damped magnetic head suspension assemblyIssued on: 04/04/1989 Inventor: Oberg5006946, Flexible polymeric resinous magnetic head supporting device Issued on: 04/09/1991 Inventor: Matsuzaki5034091, Method of forming an electrical via structure Issued on: 07/23/1991 Inventor: Trask, et al.5196377, Method of fabricating silicon-based carriers Issued on: 03/23/1993 Inventor: Wagner, et al.5231756, Process for manufacturing a multi-layer lead frame Issued on: 08/03/1993 Inventor: Tokita, et al.5391842, Carrier strip head interconnect assembly Issued on: 02/21/1995 Inventor: Bennin, et al.5473488, Static attitude adjustment via a solidified drop for a magnetic head suspension Issued on: 12/05/1995 Inventor: Gustafson, et al.5491597, Gimbal flexure and electrical interconnect assembly Issued on: 02/13/1996 Inventor: Bennin, et al.5519552, Rotary disk storage unit and head suspension therefor Issued on: 05/21/1996 Inventor: Kohira, et al.5528819, Combination transducer/slider/suspension and method for making Issued on: 06/25/1996 Inventor: McKay, et al.5530604, Electrical connection and slider-suspension assembly having an improved electrical connection Issued on: 06/25/1996 Inventor: Pattanaik5539596, Integrated suspension, actuator arm and coil assembly with common structural support layer Issued on: 07/23/1996 Inventor: Fontana, et al.5597496, Method for manufacturing a magnetic head suspension provided with circuit wiring Issued on: 01/28/1997 Inventor: Masaichi, et al.5694270, Head assembly having laminated conductor patterns Issued on: 12/02/1997 Inventor: Sone, et al.5717547, Multi-trace transmission lines for R/W head interconnect in hard disk drive Issued on: 02/10/1998 Inventor: Young5754369, Head suspension with self-shielding integrated conductor trace array Issued on: 05/19/1998 Inventor: Balakrishnan5812344Suspension with integrated conductor trace array having optimized cross-sectional high frequency current density Issued on: 09/22/1998 Inventor: Balakrishnan International ClassG11B 005/48 |
