Multi-layered integrated conductor trace array interconnect structure having optimized electrical parameters
April 6, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesDamped magnetic head suspension assembly Flexible polymeric resinous magnetic head supporting device Method of forming an electrical via structure Method of fabricating silicon-based carriers Process for manufacturing a multi-layer lead frame Carrier strip head interconnect assembly Static attitude adjustment via a solidified drop for a magnetic head suspension Gimbal flexure and electrical interconnect assembly Rotary disk storage unit and head suspension therefor Combination transducer/slider/suspension and method for making InventorAssigneeApplicationNo. 056893 filed on 04/06/1998US Classes:360/245.9Flexible printed circuit typeExaminersPrimary: Evans, JeffersonAttorney, Agent or FirmInternational ClassG11B 005/48AbstractA head suspension has an integrated multi-layer trace conductor array for supporting and electrically interconnecting a read/write head to electronic circuitry in a disk drive. The electrical micro strip transmission line characteristics of the conductor array is controlled by the selective placement and connection of the trace paths within the multiple layers in order to control and balance electrical parameters including array inductance, inter-trace capacitance, and trace capacitance to a ground plane. The ground plane may further comprise a solid sheet of material or an arrangement of grounded traces disposed in proximity to signal-carrying traces of the micro strip transmission line in order to control and obtain desired electrical characteristics. | |
