Fabricating interconnects and tips using sacrificial substrates
Patent 5994152 Issued on November 30, 1999.
Estimated Expiration Date: 
January 24, 2017.
Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
January 24, 2017.
Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
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Methods of solid-phase bonding mating members through an interposed
pre-shaped compliant medium
Device for connecting leadless integrated circuit package to a printed
circuit board
Method of making electrically conductive connector
Semiconductor device package having lead frame structure with integral
spring contacts
Adjustable holder assembly for positioning a vacuum chuck
Method of forming an interconnector
Electrical connector employing conductive rectilinear elements
Semiconductor pellet assembly mounted on ceramic substrate
Electrical contacts
Method for making conduction-cooled circuit package
Semiconductor device having multi-layer wiring structure with additional
through-hole interconnection
Method of fabricating an array of flexible metallic interconnects for
coupling microelectronics components
Electrical package for LSI devices and assembly process therefor
Method of manufacturing semiconductor devices having a copper heat
capacitor and/or copper heat sink
Hybrid circuit connector assembly
Method of making hermetic coaxial cable
Method for contacting contact areas located on semiconductor bodies
Electrical coil and method of producing the same
Multi-contact connector for ceramic substrate packages and the like
Probe device for integrated circuit wafers
Studded chip attachment process
Integrated test and assembly device
Lead frame and chip carrier housing
Multiple solder pre-form with non-fusible web
Integrated circuit device package interconnect means
Electronic package assembly method
Method of assembling semiconductor integrated circuit
Arrangement for mounting dual-in-line packaged integrated circuits to
thick/thin film circuits
Surface to surface connector
Interconnectors
Integrated test and assembly device
High performance semiconductor package assembly
Pyroelectric detector
Press-contact type interconnectors
Fabrication of circuit packages using solid phase solder bonding
Method of making inductance
Electronics circuit device and method of making the same
Universal circuit board test fixture
Method of fabricating complex micro-circuit boards and substrates
Electronic circuit interconnection system
VLSI Packaging system
Adapting contacts for connection thereto
Process and structure for minimizing delamination in the fabrication of
multi-layer ceramic substrate
Ceramic chip carrier with lead frame having removable rim
Power, ground and decoupling structure for chip carriers
Cast solder leads for leadless semiconductor circuits
Process of making multi-layer ceramic package
High melting point process for Au:Sn:80:20 brazing alloy for chip
carriers
Method for manufacturing substrate with selectively trimmable resistors
between signal leads and ground structure
Method of making constant bonding wire tail lengths
Lead frame wire bonding by preheating
Socket terminal positioning method and construction
Method of providing raised electrical contacts on electronic
microcircuits
Substrate with multiple type connections
LSI Chip carrier with buried repairable capacitor with low inductance
leads
Method of bonding connecting pins to the eyelets of conductors formed on
a ceramic substrate
Electronic circuit interconnection system
Electronic socket having spring probe contacts
Electronic component with plurality of terminals thereon
Metallization and bonding means and method for VLSI packages
Integrated circuit package having interconnected leads adjacent the
package ends
Method of fabricating an electronic circuit including an aperture
through the substrate thereof
Contact device for releasably connecting electrical components
Method for manufacturing multilayer circuit substrate
Apparatus and method for testing circuit boards
Fabrication of a printed circuit board with metal-filled channels
Electrically conductive composite material
Hybrid integrated circuit device
Method for forming elongated solder connections between a semiconductor
device and a supporting substrate
Electronic circuit interconnection system
High density electronics packaging system for hostile environment
Leadless chip carrier apparatus providing an improved transmission line
environment and improved heat dissipation
High density planar interconnected integrated circuit package
Semiconductor chip mounting system
Microminiature coaxial cable and methods manufacture
Component mounting apparatus
Wire bonding method and device
Pressure interconnect package for integrated circuits
Bonding tool and clamp assembly and wire handling method
Solder interconnection structure for joining semiconductor devices to
substrates that have improved fatigue life, and process for making
Spring finger interconnect for IC chip carrier
Automatic assembly of integrated circuits
Method of packaging integrated circuit chips, and integrated circuit
package
Surface mounting connector
Connector assembly for making multiple connections in a thin space
Hermetic chip carrier compliant soldering pads
Semiconductor package with contact springs
Surface mount compatible connector system with mechanical integrity
Compliant interconnection and method therefor
Chip carrier alignment device and alignment method
Compliant lead clip
Integrated circuit package, and method of forming an integrated circuit
package
Semiconductor package with tape mounted die
Method of thermal diffusion alloy plating for steel wire on continuous
basis
Low cost integrated circuit bonding process
Chip mounting device
Semiconductor chip interface
Integrated circuit chip-and-substrate assembly
Surface mounted system for leaded semiconductor devices
Thermosonic palladium lead wire bonding
Ceramic IC package attachment apparatus
Flexible film semiconductor chip carrier
Process of forming integrated circuits with contact pads in a standard
array
Connecting structure for a display device
Inverted chip carrier
High density micropackage for IC chips
Ultra high density pad array chip carrier
Method of making an ultra high density pad array chip carrier
Mounting structure of flat-lead package-type electronic component
Chip carrier mounting device
Manufacturing method for an electronic component
Method for producing an integrated circuit product having a polyimide
film interconnection structure
Integrated circuit chip package
Compressive pedestal for microminiature connections
Interconnect tape for use in tape automated bonding
PC board test fixture
Apparatus and method for manufacturing semiconductor device
Electric component part having lead terminals
Micromechanical elements and methods for their fabrication
Mounting panel for removable elements
Circuit board with a chip carrier and mounting structure connected to
the chip carrier
Process of forming a compliant lead frame for array-type semiconductor
packages
Semiconductor integrated circuit device having a multi-layered wiring
board for ultra high speed connection
Solid state interconnection system for three dimensional integrated
circuit structures
High density probe card
Semiconductor device and process for producing the same
Surface mounted array strain relief device
Solder mounting of electrical contacts
Pretestable double-sided tab design
Leadform for use with surface mounted components
Test connector for electrical devices
Process for encapsulating microelectronic semi-conductor and layer type
circuits
Method of joining beam leads with projections to device electrodes
Electrical circuit board interconnect
Peripheral/area wire bonding technique
Semiconductor device having stacking structure
High performance integrated circuit packaging structure
Mounting of semiconductor chips on a plastic substrate
Process for manufacturing plastic pin grid arrays and the product
produced thereby
Method of making a hybrid semiconductor device
Adhesive component means for attaching electrical components to
conductors
Resin packaged semiconductor device having a protective layer made of a
metal-organic matter compound
Compliant S-leads for chip carriers
Welding arc initiator
High density probe card
Method and apparatus for applying solder preforms
Full panel electronic packaging structure
Method of forming bump electrode and electronic circuit device
Orthogonal bonding method and equipment
Method of manufacturing an inductance element
Fixture for plating tall contact bumps on integrated circuit
Plastic molded pin grid chip carrier package
Flexible electrical connection and method of making same
Fixture for plating tall contact bumps on integrated circuit
Method of manufacturing a multichip package with increased adhesive
strength
Process of packaging a semiconductor device with reduced stress forces
Wire bonding apparatus
Semiconductor integrated circuit device
Process for controlling solder joint geometry when surface mounting a
leadless integrated circuit package on a substrate
Electronic circuit chip connection assembly and method
Method and configuration for testing electronic circuits and integrated
circuit chips using a removable overlay layer
Pin grid array package structure
A chip carrier and mounting structure connected to the chip carrier
Connecting structure for electronic part and method of manufacturing the
same
Personality board
Compressive pedestal for microminiature connections
Chip carrier with interconnects on lid
Connection to a component for use in an electronics assembly
Method of bonding gold or gold alloy wire to lead tin solder
Process of fabricating a circuit package
Method for fabricating three-dimensional microstructures and a
high-sensitivity integrated vibration sensor using such microstructures
Multichip integrated circuit packaging method
Spring grid array interconnection for active microelectronic elements
Connector system for coupling to an integrated circuit chip
Flip substrate for chip mount
Fixture and a method for plating contact bumps for integrated circuits
Ultra-high density electrical interconnect system
Method and configuration for testing electronic circuits and integrated
circuit chips using a removable overlay layer
Semiconductor integrated circuit device
Method of packaging semiconductor device
Thick film packages with common wafer aperture placement
Pendulum with bending spring joint
Method of packaging and powering integrated circuit chips and the chip
assembly formed thereby
Interconnection of electronic components
Interconnect structure for integrated circuits
Tape carrier for assembling an IC chip on a substrate
Use of tapered head pin design to improve the stress distribution in the
braze joint
Connector assembly for chip testing
High density integrated circuit package
Driven guard probe card
Semiconductor package having leads that break-away from supports
Elastomeric area array interposer
Fabrication of pad array carriers from a universal interconnect structure
Laser-arc apparatus and method for controlling plasma cloud
Testable ribbon bonding method and wedge bonding tool for microcircuit
device fabrication
Method for parallel testing of semiconductor devices
Electrical contact bump and a package provided with the same
Method of making high density solder bumps and a substrate socket for
high density solder bumps
Fixture and a method for plating contact bumps for integrated circuits
Assembly of semiconductor chips
TAB tape translator for use with semiconductor devices
Method and apparatus for wire bonding
Lead frame and semiconductor device using the same
Low phosphorus containing band-shaped and/or filamentary material
Pad array carrier IC device using flexible tape
Three dimensionally interconnected module assembly
Field emitter array integrated circuit chip interconnection
Demountable tape-automated bonding system
Probe plate used for testing a semiconductor device, and a test
apparatus therefor
Method of mounting integrated circuit interconnect leads releasably on
film
Connector contact
Method of electrically connecting integrated circuits by edge-insertion
in grooved support members
Process of forming bump on electrode of semiconductor chip and apparatus
used therefor
Molded integrated circuit package incorporating heat sink
Probe system for device and circuit testing
Semiconductor device having leads for mounting to a surface of a printed
circuit board
Array connector
Grounding an ultra high density pad array chip carrier
Particle-enhanced joining of metal surfaces
Connecting structure of electronic part and electronic device using the
structure
Compliant solder interconnection
Method of forming an electrical contact bump
Weakening wire supplied through a wire bonder
Noble metal plated wire and terminal assembly, and method of making the
same
Method of making a post molded cavity package with internal dam bar for
integrated circuit
Method and apparatus for wire bonding
5118027
Non-destructive burn-in test socket for integrated circuit die
Flexible automated bonding method and apparatus
Disposable high performance test head
Durable plating for electrical contact terminals
Solder mass having conductive encapsulating arrangement
Flexible film semiconductor package
Electrical socket
Flexible film chip carrier having a flexible film substrate and means
for maintaining planarity of the substrate
Overmolded semiconductor package with anchoring means
Low cost erasable programmable read only memory package
Interconnection structure and test method
Apparatus for testing integrated circuits
Semiconductor chip assemblies with fan-in leads
Semiconductor chip assemblies having interposer and flexible lead
Solder bump stretch device
Surface mount electrical connector
Noncollapsing multisolder interconnection
Compact, wireless apparatus for electrically testing printed circuit
boards
Contact assembly with grounding conductor support
Method of forming a bump electrode and manufacturing a
resin-encapsulated semiconductor device
Area array connector
Membrane probe contact bump compliancy system
Method of fabricating nendritic materials
Compliant contact pad
Interconnection of electronic components
Wire bonding method
Low cost erasable programmable read only memory package
Integrated circuit interconnect leads releasably mounted on film
Electrically conductive polymeric
Electrically conductive polymeric materials and uses thereof
Process for enhanced intermetallic growth in IC interconnections
Electrically conductive polymeric materials and uses thereof
Lead grid array integrated circuit
Thermally reactive lead assembly and method for making same
Solder bump transfer method
Apparatus for inspecting internal circuit of semiconductor device
Heat recoverable soldering device
Composite lead frame and semiconductor device using the same
Fluid pressure actuated connector
Dual element electrical contact and connector assembly utilizing same
Aligned wafer bonding
5237203
Vertical lead-on-chip package
Stepped electronic device package
Leadless pad array chip carrier
Method for forming a bump by bonding a ball on an electrode of an
electronic device and apparatus for forming the same
Dry-release method for sacrificial layer microstructure fabrication
Semiconductor chip assemblies with fan-in leads
Bump forming method
Inherently impedance matched multiple integrated circuit module
Electronic packages and smart structures formed by thermal spray
deposition
Multi-layer circuit construction methods with customization features
Via paste compositions and use thereof to form conductive vias in
circuitized ceramic substrates
Wire-bonding method, wire-bonding apparatus, and semiconductor device
produced by the wire-bonding method
Apparatus and methods for making simultaneous electrical connections
Peripheral to area adapter with protective bumper for an integrated
circuit chip
Electrode structure of a semiconductor device which uses a copper wire
as a bonding wire
Plated compliant lead
Spring array connector
Discrete die burn-in for non-packaged die
Multi-chip integrated circuit module and method for fabrication thereof
Leads for semiconductor chip assembly and method
Device for interconnecting integrated circuit packages to circuit boards
Method of preventing short-circuiting of bonding wires
Micromechanical barb and method for making the same
Electrical connections between printed circuit boards and integrated
circuits surface mounted thereon
Method for bonding lead with electrode of electronic device
Plated compliant lead
Multi-chip module testing
Adhesive layer in multi-level packaging and organic material as a metal
diffusion barrier
Three dimensional assembly of integrated circuit chips
High density interconnect structure including a chamber
Process for producing ceramic circuit structures having conductive vias
Pressure differential downset
Rigid-flex circuits with raised features as IC test probes
Semiconductor chip assemblies and methods of making same
Semiconductor chip assemblies with face-up mounting and rear-surface
connection to substrate
Preformed planar structures employing embedded conductors
Film carrier semiconductor device
Three dimensional multi-chip module with integral heat sink
Spring biased tapered contact elements for electrical connectors and
integrated circuit packages
Bonding pad with circular exposed area and method thereof
Method of making a multi-layer circuit assembly
Method of forming multi-chip module with high density interconnections
Test probe for panel having an overlying protective member adjacent
panel contacts
Compact adapter package providing peripheral to area translation for an
integrated circuit chip
Casting of raised bump contacts on a substrate
High density probe card for testing electrical circuits
Flex circuit card elastomeric cable connector assembly
Fabrication of a dissolvable film carrier containing conductive bump
contacts for placement on a semiconductor device package
Semiconductor inner lead bonding tool
Process for fabricating submicron single crystal electromechanical
structures
Non-destructive interconnect system for semiconductor devices
Shaped lead structure and method
Printed circuit board testing device with foil adapter
Semiconductor chip assemblies and components with pressure contact
Semi-conductor device interconnect package assembly for improved package
performance
Large scale protrusion membrane for semiconductor devices under test
with very high pin counts
Method and apparatus for testing an unpackaged semiconductor die
Multi-chip integrated circuit module
Integrated circuit having a coplanar solder ball contact array
Testing and exercising individual, unsingulated dies on a wafer
Thin semiconductor integrated circuit device assembly
Interior bond pad arrangements for alleviating thermal stresses
Microelectronics unit mounting with multiple lead bonding
Electrical interconnect using particle enhanced joining of metal surfaces
Method of manufacturing electrical contacts, using a sacrificial member
Method of forming interface between die and chip carrier
Film-type heat sink-mounted power resistor combination having only a
thin encapsulant, and having an enlarged internal heat sink
Semiconductor connection components and method with releasable lead
support
Microelectronic bonding with lead motion
Method for forming contact pins for semiconductor dice and interconnects
Microelectronic mounting with multiple lead deformation and bonding
Semiconductor chip assemblies and components with pressure contact
Semiconductor connection components and methods with releasable lead
support
5548091
Compliant thermal connectors and assemblies incorporating the same
Device for facilitating sheet separation or singling
Multi-layer circuit structures, methods of making same and components
for use therein
Tissue-connective devices with micromechanical barbs
Multi-Layer circuit construction method and structure
Method of making multilayer circuit
Method for making a flexible lead for a microelectronic device
Method and apparatus for wirebonding, for severing bond wires, and for
forming balls on the ends of bond wires
Patent #: 5601740
Inventors
ApplicationNo. 788740 filed on 01/24/1997
US Classes:438/617, By wire bonding 438/15, Packaging (e.g., with mounting, encapsulating, etc.) or treatment of packaged semiconductor 438/117 Incorporating resilient component (e.g., spring, etc.)
ExaminersPrimary: Picardat, Kevin M.
Attorney, Agent or Firm
Foreign Patent References
International ClassH01L 021/44AbstractInterconnection elements and/or tip structures for interconnection elements may first be fabricated upon sacrificial substrates for subsequent mounting to electronic components. In this manner, the electronic components are not `at risk` during the fabrication process. The sacrificial substrate establishes a predetermined spatial relationship between the interconnection elements which may be composite interconnection elements having a relatively soft elongate element as a core and a relatively hard (springy material) overcoat. Tip structures fabricated on sacrificial substrates may be provided with a surface texture optimized for mounting to any interconnection elements for making pressure connections to terminals of electronic components. Interconnection elements may be fabricated upon such tip structures, or may first be mounted to the electronic component and the tip structures joined to the free-ends of the interconnection elements. Tip structures formed as cantilever beams are described.Other References
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