Flux cleaning for flip chip technology using environmentally friendly solvents
Patent 5988485 Issued on November 23, 1999. Estimated Expiration Date: 
March 17, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
March 17, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod and apparatus for vapor phase soldering and cleaning products Patent #: 5181648 InventorsAssigneeApplicationNo. 040651 filed on 03/17/1998US Classes:228/180.22, Lead-less (or "bumped") device228/19, WITH MEANS TO REMOVE, COMPACT, OR SHAPE APPLIED FLUX OR FILLER228/201, Cleaning228/202ChemicalExaminersPrimary: Ryan, PatrickAssistant: Knapp, Jeffrey T. Attorney, Agent or FirmForeign Patent References
International ClassB23K 001/018AbstractA method of assembling a substrate and die in a flip chip configuration uses a non-hazardous cleaning solvent to clean the flux residue. The non-hazardous cleaning solvent utilized is Ionox obtained from Kyzen Corporation. Optimized process parameters are: time 10-30 minutes, temperature 70-90° C., pressure 40-70 psi, rotation speed and reversals 100-1000 rpm and 24-100 reversal cycles.Other References
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