Abstract

A surgical instrument is provided which is formed of a semiconductor substrate material having at least one anisotropically etched sharpened edge and a heating circuit disposed on the substrate. The heating circuits generate heat by means of resistive elements interposed along the circuit path. The substrate material itself may serve as the resistive elements, or resistive layers may be used in the alternative. The resistive heating may be used to heat the sharpened edge directly, or the heating may be thermally isolated from the sharpened edge. The heating circuit may also include a thermal sensor which may be used to control the generation of heat and/or detect damage to the instrument itself. The conformation of the instrument may include a variety of different shapes, including central recesses and windows. The recesses may further include ribs or support members. The substrate may further a suction mechanism for removing fluid which may build up in the vicinity of the surgery.