Aqueous rinsing composition
September 23, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3629127 Rinse composition Method for cleaning membrane filter Acidic hydrocarbon-in-water emulsions Agent and method for the removal of photoresist and stripper residues from semiconductor substrates Method for rinse treatment of a substrate Fabric conditioner comprising a mixture of quaternary ammonium compounds and select tertiary amines Surface treating agent for aluminum line pattern substrate Alcohol-free, oral rinse and pre-rinse emulsions method of prepration and method of use Aqueous lubricant and surface conditioner for formed metal surfaces InventorAssigneeApplicationNo. 936010 filed on 09/23/1997US Classes:510/175, For printed or integrated electrical circuit, or semiconductor device510/421, Polyoxyalkylene containing surfactant devoid of covalently bonded anionic substituents510/434, Polycarboxylic acid component, or acid anhydride or salt thereof (e.g., acrylic acid polymer, maleic anhydride, sodium citrate, etc.)510/477, Polycarboxylic acid component, or salt thereof510/488, Carboxylic acid, or salt thereof510/505, Oxygen in the component (except substituted triazines)510/506, Ether510/522Liquid compositionExaminersPrimary: Gupta, Yogendra N.Assistant: Webb, Gregory E. Attorney, Agent or FirmInternational ClassC11D 001/722AbstractThe present invention is directed to an aqueous post-strip rinsing composition, comprising (1) water; (2) at least one water-soluble organic acid; and (3) at least one water-soluble surface-active agent, the rinse solution having a pH in the range from about 2.0 to about 5.0. The present invention is also directed to a method of using the above composition to remove residues from a semiconductor substrate.Field of SearchFor printed or integrated electrical circuit, or semiconductor devicePolyoxyalkylene containing surfactant devoid of covalently bonded anionic substituents Carboxylic acid, or salt thereof Oxygen in the component (except substituted triazines) Ether Liquid composition Polycarboxylic acid component, or acid anhydride or salt thereof (e.g., acrylic acid polymer, maleic anhydride, sodium citrate, etc.) Polycarboxylic acid component, or salt thereof | |
