Non-contacting technique for electroplating X-ray lithography
Dry contact electroplating apparatus
Device for one-sided etching of a semiconductor wafer
Workpiece holder apparatus
Plating device for wafer Patent #: 5429733
ApplicationNo. 070387 filed on 04/30/1998
US Classes:204/224R, Localized area applicators204/285, Work holder204/287, Work container204/288.1, And dielectric gasket or spacer204/288.3, Including resilient means (e.g., spring, etc.)204/297.1, Including resilient means (e.g., spring, etc.)257/E21.175Using an external electrical current, i.e., electro-deposition (EPO)
ExaminersPrimary: Valentine, Donald R.
International ClassC25D 017/06
AbstractAn apparatus may be used to deposit metal or conductive layers upon semiconductor wafers using an electrochemical process. The apparatus comprises a housing for retaining a first electrode (e.g., anode) and a second electrode (e.g., cathode), in a fixed spaced-apart relation to each other, with the surface area of the anode exceeding the surface area of the cathode (the wafer). The back surface of the wafer is mounted on a handling disk; the disk has an aperture for accessing the wafer and is held in the housing. A contact probe passes through the aperture to touch the back surface of the wafer, the probe having a spring-loaded spherical radius head for depressurizing the head as it touches the wafer. This apparatus permits a uniform current distribution as the contact probe is not interposed between the electrodes, and the larger surface area of the anode relative to the wafer enhances the production of uniform and reproducible films. The housing may be comprised of at least two separable parts so that access may be readily gained to the inner cavity of the housing, thus enhancing the ease with which the device may be used. The handling disk as well as the spring-loaded probe head reduce the risk of wafer damage.