Method for making high-critical-current-density YBa₂ Cu₃ O₇ superconducting layers on metallic substrates

Patent 5972847 Issued on October 26, 1999. Estimated Expiration Date:

January 28, 2018. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Inventors

Assignee

Lockheed Martin Energy Research Corp

Application

No. 014481 filed on 01/28/1998

US Classes:

505/473, Vapor deposition505/238, Superconductor next to layer containing nonsuperconducting ceramic composition or inorganic compound (e.g., metal oxide, metal nitride, etc.)505/500, Heating, annealing, or sintering505/732, Evaporative coating with superconducting material505/742Annealing

Examiners

Primary: King, Roy V.

Attorney, Agent or Firm

Quarles & Brady LLp

International Classes

B05D 005/12
C23C 014/24

Abstract

A method is disclosed for fabricating YBa2 Cu3 O7 superconductor layers with the capability of carrying large superconducting currents on a metallic tape (substrate) supplied with a biaxially textured oxide buffer layer. The method represents a simplification of previously established techniques and provides processing requirements compatible with scale-up to long wire (tape) lengths and high processing speeds. This simplification has been realized by employing the BaF2 method to grow a YBa2 Cu3 O7 film on a metallic substrate having a biaxially textured oxide buffer layer.

Other References

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