Screen printable UV curable conductive material composition
Patent 5968606 Issued on October 19, 1999. Estimated Expiration Date: 
June 30, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
June 30, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 383511 2428608 3354123 3882033 High voltage insulating materials Compliant thermally conductive compound Heat sink assembly for solid state devices Die attach adhesive film, application method and devices incorporating the same Integrated circuit packages with heat dissipation for high current load Conductive composite articles based on expandable and contractible particulate matrices Patent #: 5672297 InventorsAssigneeApplicationNo. 884995 filed on 06/30/1997US Classes:427/510, Nonuniform or patterned coating (e.g., mask, printing, textured, etc.)257/717, Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer)257/E23.107, Organic materials with or without thermo-conductive filler (EPO)522/71, Processes of preparing or treating a solid polymer by wave energy in the presence of a designated nonreactant material (DNRM); or compositions therefore524/401, Inorganic compound devoid of a silicon atom DNRM524/404, Boron atom DNRM524/495Mixing with carbon, e.g., graphite, etc., having numerical limitations, other than amount, e.g., included herein are particle size, surface area, etc., or composition or product thereof, DNRMExaminersPrimary: Yoon, Tae H.Attorney, Agent or FirmForeign Patent References
International ClassesC08J 007/18C08K 003/00 C08K 003/38 H01L 023/36 AbstractThe present invention provides a novel UV curable composition for forming thermally conductive interface and a method of using the same. The composition is used to promote the transfer of heat from a source of heat such as an electronic device to a heat dissipation device such as a heat sink. The composition comprises by weight from about 35% to about 75% of a UV curable acrylate material, from about 0.5% to about 15% catalyst, from about 10% to about 30% hydrocarbon solvent and from about 20% to about 70% conductive filler.Field of SearchNonuniform or patterned coating (e.g., mask, printing, textured, etc.)Isolation of cooling means (e.g., heat sink) by an electrically insulating element (e.g., spacer) Processes of preparing or treating a solid polymer by wave energy in the presence of a designated nonreactant material (DNRM); or compositions therefore Boron atom DNRM | |
