ICP reactor having a conically-shaped plasma-generating section
March 5, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent ReferencesMethod and apparatus for producing magnetically-coupled planar plasma Plasma generating apparatus employing capacitive shielding and process for using such apparatus Radio frequency induction plasma processing system utilizing a uniform field coil Induction plasma source Coil configurations for improved uniformity in inductively coupled plasma systems Induction plasma source Method of treating a workpiece with a plasma and processing reactor having plasma igniter and inductive coupler for semiconductor fabrication Inductively coupled high density plasma reactor for plasma assisted materials processing Plasma reactor with multi-section RF coil and isolated conducting lid Sputter etching apparatus with plasma source having a dielectric pocket and contoured plasma source InventorAssigneeApplicationNo. 811893 filed on 03/05/1997US Classes:118/723I, Radio frequency antenna or radio frequency inductive coil discharge means156/345.48With radio frequency (rf) antenna or inductive coil gas energizing meansExaminersPrimary: Breneman, R. BruceAssistant: Alejandro, Luz Attorney, Agent or FirmForeign Patent References
International ClassC23C 016/00AbstractDisclosed is an inductively-coupled plasma reactor that is useful for anisotropic or isotropic etching of a substrate, or chemical vapor deposition of a material onto a substrate. The reactor has a plasma-generation chamber with a conically-shaped plasma-generating portion and coils that are arranged around the plasma-generating portion in a conical spiral. The chamber and coil may be configured to produce a highly uniform plasma potential across the entire surface of the substrate to promote uniform ion bombardment for ion enhanced processing. In addition, a conical chamber and coil configuration may be used to produce activated neutral species at varying diameters in a chamber volume for non-ion enhanced processing. Such a configuration promotes the uniform diffusion of the activated neutral species across the wafer surface.Other References
Field of SearchBy creating electric field (e.g., gas activation, plasma, etc.)Radio frequency antenna or radio frequency inductive coil discharge means Producing energized gas remotely located from substrate Having glow discharge electrodes (e.g., DC, AC, RF, etc.) Producing energized gas remotely located from substrate Having antenna Induction type | |
