U.S. patents available from 1976 to present.
U.S. patent applications available from 2005 to present.

Radiation sensitive composition

Patent 5962187 Issued on October 5, 1999. Estimated Expiration Date: Icon_subject October 21, 2017. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Patent References

Negative-working photosensitive coating solution containing photohardenable diazo compound, polymeric binder and four component solvent
Patent #: 5302487
Issued on: 04/12/1994
Inventor: Arneth, et al.

Cyclic carbonate compounds, method for producing the same and positive photoresist composition using the same
Patent #: 5420331
Issued on: 05/30/1995
Inventor: Ueda, et al.

Composition and method for removing photoresist composition from substrates surfaces
Patent #: 5426017
Issued on: 06/20/1995
Inventor: Johnson

Solvent system for forming films of photoimageable compositions
Patent #: 5458921
Issued on: 10/17/1995
Inventor: Briguglio, et al.

Solvent composition
Patent #: 5612303
Issued on: 03/18/1997
Inventor: Takayanagi, et al.

Chemically amplified resist composition Patent #: 5629135
Issued on: 05/13/1997
Inventor: Kobayashi, et al.

Inventor

Assignee

Application

No. 955453 filed on 10/21/1997

US Classes:

430/270.1, Radiation sensitive composition or product or process of making430/191And monomeric processing ingredient

Examiners

Primary: Baxter, Janet
Assistant: Ashton, Rosemary

Attorney, Agent or Firm

Foreign Patent References

  • 0 410 277 EP. 01/21/1991
  • 0 634 696 EP. 01/21/1995
  • 4-9063 JP. 01/21/1992
  • 152155 JP. 06/21/1995
  • 9205780 KR. 07/21/1992

International Class

G03C 001/492

Foreign Application Priority Data

1996-10-25 JP

Abstract

A radiation sensitive composition containing resist materials such as quinonediazido photo active compound and alkali soluble resin, and a mixed solvent comprising (A) 1 to 25% by weight of propylene glycol derivatives as represented by the formula:R1 --O--CH2 CH(CH3)--O--R2wherein R1 and R2 are hydrogen atom, alkyl group having 2 to 5 carbons and acetyl group, and total number of carbons in R1 and R2 is less than 8, both the R1 and R2 are not hydrogen atom at the same time, and (B) 75 to 99% by weight of at least one kind of solvent selected from propylene glycol monomethyl ether acetate and ethyl lactate. The radiation sensitive composition is used for the manufacturing of semiconductor device and liquid crystal display element. The solvent is safe to human body and the amount of residual solvent in the resist film is small.

Other References

  • English translation of JP 4-9063, 199
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