Patent References 1508843 2590948 Adjustable conical atomizer MOCVD method and apparatus Two cycle internal combustion engine Surface processing apparatus Method for chemical vapor deposition of titanium nitride films at low temperatures Method for forming dielectric Programmable multizone gas injector for single-wafer semiconductor processing equipment Showerhead for a gas supplying apparatus InventorsAssigneeApplicationNo. 948579 filed on 10/10/1997US Classes:239/132.3, Cooling of terminal element118/715, GAS OR VAPOR DEPOSITION239/139, Spaced jacket or compartment for heating fluid239/428, Combining of three or more separate streams239/432Including additional dispersing plate or obstruction in mixing chamberExaminersPrimary: Weldon, KevinAttorney, Agent or FirmForeign Patent References
International ClassC23C 016/00Foreign Application Priority Data1996-10-11 JPAbstractA reactant gas ejector head enables a process gas mixture of a uniform concentration and composition to be delivered to the surface of a substrate in a stable and uniform thermodynamic state by preventing premature reactions to occur along the gas delivery route. The reactant gas ejector head comprises an ejection head body having a back plate and a nozzle plate for defining a gas mixing space therebetween. The nozzle plate has numerous gas ejection nozzles. A gas supply pipe is communicated with the ejection head body through a center region of the back plate so as to separately introduce at least two types of gaseous substances into the mixing space. Gas distribution passages are formed between the back plate and the nozzle plate in such a way as to guide the at least two types of gaseous substances from the gas supply pipe to be directed separately towards peripheral regions of the gas mixing space.Other References
Field of SearchIncluding additional dispersing plate or obstruction in mixing chamberCombining of three or more separate streams Concurrent or concentric flow means Flow means of one fluid surrounds the other at outlet WITH HEATING OR COOLING MEANS FOR THE SYSTEM OR SYSTEM FLUID In terminal element (e.g., injection nozzle cooling) Cooling of terminal element Spaced jacket or compartment for heating fluid Heated coating material Silicon containing coating Chemical vapor deposition (e.g., electron beam or heating using IR, inductance, resistance, etc.) Styrene or carboxamide group containing coating material (e.g., urea, urethane, etc.) GAS OR VAPOR DEPOSITION By means to heat or cool Substrate heater Crucible or evaporator structure | |