Thermal printhead, substrate for the same and method for making the substrate

Patent 5949465 Issued on September 7, 1999. Estimated Expiration Date:

December 6, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.

Abstract Claims Description Full Text

Patent References

Thermal head
Patent #: 4742362
Issued on: 05/03/1988
Inventor: Takoshima , et al.

Thermal printhead with enhanced laterla heat conduction Patent #: 5357271
Issued on: 10/18/1994
Inventor: Wiklof, et al.

Inventors

Assignee

Rohm Co., Ltd.

Application

No. 750377 filed on 12/06/1996

US Classes:

347/205Head substrate

Examiners

Primary: Tran, Huan

Attorney, Agent or Firm

Foreign Patent References

0 605 190 A2 EP 07/21/1994
3906484 DE 09/21/1990
57-64576 JP 04/21/1982
59-83682 JP 05/21/1984
60-6478 JP 01/21/1985
60-13565 JP 01/21/1985
61-254362 JP 11/21/1986
62-95240 JP 05/21/1987
2-45163 JP 02/21/1990
3-290268 JP 12/21/1991
5-177854 JP 07/21/1993
6-166197 JP 06/21/1994

International Class

B41J 002/335

Foreign Application Priority Data

1994-06-21 JP

Abstract

A thermal printhead according to the present invention includes a substrate (2) of an insulating material, a heating resistor (3) formed on the substrate (2) to form a plurality of heating dots, a conductor pattern (5, 6) formed on the substrate (2) for electrical connection to the heating resistor (3), and driving elements mounted on the substrate (2) for selectively heating the heating dots via the conductor pattern (5, 6). The substrate (2) has, at the position of the heating resistor (3), a raised portion (2a) and the substrate (2) has, in its wall thickness at the position of the raised portion (2a), a hollow portion (10) extending along the heating resistor (3). The present invention also provides a method for making the substrate (2).