EMI shield and a method of forming the same
Patent 5945213 Issued on August 31, 1999. Estimated Expiration Date: 
August 27, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.
August 27, 2016. Estimated Expiration Date is calculated based on simple USPTO term provisions. It does not account for terminal disclaimers, term adjustments, failure to pay maintenance fees, or other factors which might affect the term of a patent.Patent References 3657003 New nickel coating composition for shielding electronic equipment and the like RFI shielded plastic articles and process for making same Coating composition Galvanically compatible conductive filler and methods of making same Process for the production of conductive and magnetic transitin metal oxide coated three dimensional substrates Patent #: 5603983 InventorsAssigneeApplicationNo. 703731 filed on 08/27/1996US Classes:428/336, 1 mil or less428/423.1, Of polyamidoester (polyurethane, polyisocyanate, polycarbamate, etc.)428/425.8, Next to free metal428/461, Next to addition polymer from unsaturated monomers428/469Next to metal salt or oxideExaminersPrimary: Thibodeau, Paul J.Assistant: Rickman, Holly Attorney, Agent or FirmForeign Patent References
International ClassesB32B 005/16B32B 027/00 Foreign Application Priority Data1995-09-04 JPAbstractImproved shield against electromagnetic interference comprises an undercoat formed on at least one surface of a nonconductive substrate comprising a jacket or case of electronic equipment or part thereof that are vulnerable to electromagnetic interference and a metal layer formed over said undercoat; said undercoat is composed of 10-60 wt % of a composite metal oxide hydrate and 40-90 wt % of a binder and said metal layer is formed by electroless plating of copper and/or nickel. | |
