Patent References 2845472 3004406 3339373 3801241 Apparatus for cooling tools of glass-forming machines by evaporation of a cooling liquid Magnetically coupled gear pump construction Gear pump with suction shoe at gear mesh point Vaporization cooled electrical apparatus Split magnet drive Three gear pump with module construction InventorsAssigneeApplicationNo. 848998 filed on 05/02/1997US Classes:361/699, Liquid62/64, By contacting with liquid62/259.2, With electrical component cooling165/80.4, Liquid cooled174/15.1, With cooling or fluid feeding, circulating or distributing257/E23.088, Cooling by change of state, e.g., use of heat pipes (EPO)257/E25.023, Device consisting of plurality of semiconductor or other solid-state devices or components formed in or on common substrate, e.g., integrated circuit device (EPO)361/695Fan or blowerExaminersPrimary: Thompson, Gregory D.Attorney, Agent or FirmInternational ClassH05K 007/20AbstractAn isothermal equilibrium system takes point sources of heat generated by the operation of heat generating components and spreads the heat throughout the system where the heat may be dissipated. An atomizer for atomizing a liquid coolant, is positioned inside a sealed housing. The atomized liquid coolant is distributed as a thin film over the surface of the heat generating components and the wall of the sealed housing. Heat is transferred from the surface of the heat generating components by vaporization of at least a portion of the thin film of liquid coolant. The coolant vapor condenses on the housing and other cool surfaces and returns to the liquid state. The system heat is then removed from the outer surfaces of the housing using conventional heat transfer mechanisms including free or forced air convection and/or circulation of liquid coolant over the exterior of the housing. If additional cooling is desired, heat exchanger tubes may be included inside the sealed housing. An input liquid or gaseous coolant is circulated through the exchanger tubes. Heat is transferred to the coolant and then conducted away from the heat generating component housing. | |